Photosensitive Silicone Coating for Stripper-Resistant Thick Film Patterning
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Solution Overview
Problem
Existing photosensitive silicone compositions for semiconductor device protection and multilayer printed circuit board insulating films face issues with poor chemical resistance to photoresist strippers, peeling after heat resistance testing, low bond strength, and inadequate solder resistance.
Innovation Solution
A photosensitive resin composition comprising an acid-crosslinkable group-containing silicone resin, an epoxy compound with a specific structure, and a photoacid generator, which enables the formation of a resin coating film with excellent solder resistance, heat resistance, and adhesion to substrates and electronic components.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If photosensitive silicone compositions are used for semiconductor device protection, then low curing temperature and moisture-resistant adhesion are achieved, but chemical resistance to photoresist strippers deteriorates
Solution Approach 1:
The patent uses a composite material system combining silphenylene skeleton-containing silicone polymer with specific crosslinking agents and photoacid generators. This composite approach allows the cured film to achieve both low-temperature curing capability and improved chemical resistance to photoresist strippers like N-methyl-2-pyrrolidone, resolving the contradiction between curing temperature and chemical resistance.
2Object-affected harmful factors
If photosensitive silicone compositions with silphenylene skeleton are used to improve chemical resistance, then resistance to photoresist strippers is improved, but bond strength with substrate deteriorates
Solution Approach 1:
The patent modifies the chemical structure parameters of the silicone polymer by introducing specific crosslinkable functional groups and optimizing the crosslinking density. This parameter change allows the material to maintain both improved chemical resistance to photoresist strippers and enhanced bond strength to substrates, eliminating the trade-off between these properties.
3Reliability
If thick film coating is applied for comprehensive protection, then reliability as protective film is improved, but formation of small geometry patterns with verticality becomes difficult
Solution Approach 1:
The patent replaces conventional high-temperature curing mechanisms with a photoacid-generator-based photocuring system. This substitution enables precise spatial control of the curing process through light exposure, allowing thick films to be cured selectively in patterned areas with excellent verticality and small geometry, while maintaining comprehensive protective reliability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The composition allows for the formation of thick films with small geometry patterns and verticality, offering excellent mechanical properties, solder resistance, heat resistance, and adhesion, while maintaining reliability as a protective coating for electrical and electronic components.
Implementation Method 1
a photoacid generator
Data Source
AI summary
Provided is a photosensitive resin composition comprising (A) a silicone resin having an acid-crosslinkable group, (B) an epoxy compound represented by formula (B1), and (C) a photoacid generator. (In formula (B1), R1 is a hydrogen atom, a C1-4 saturated hydrocarbyl group, a phenyl group, a hydroxyphenyl group, or a halogen-substituted phenyl group.)