Thermally Conductive Silicone Composition for Humidity Reliability
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Solution Overview
Problem
Existing thermally conductive silicone compositions face challenges in achieving high thermal conductivity, low weight, and reliability in high humidity due to the use of fillers like aluminum oxide and magnesium oxide, which can cause equipment wear and hygroscopic issues.
Innovation Solution
A combination of magnesium oxide with a specific surface area of 0.4 m2/g or less and aluminum hydroxide, blended in a specific ratio, is used in an addition-reaction curable silicone resin composition to achieve a thermally conductive silicone resin with improved thermal conductivity, low weight, and reliability in high humidity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a large amount of thermally conductive filler is highly filled to increase thermal conductivity, then thermal conductivity is improved, but fluidity decreases and degree of plasticity increases, resulting in poor moldability
Solution Approach 1:
The patent applies parameter changes by precisely controlling the particle size distribution (D10, D50, D90 values) and specific surface area (0.01 to 0.5 m²/g) of the filler particles. By optimizing these parameters, the invention achieves high thermal conductivity with improved fluidity and moldability compared to conventional high-fillers approaches
Solution Approach 2:
The patent uses composite materials by combining thermally conductive filler particles with a silicone resin matrix. The specific composition ratio and particle size distribution create a composite structure that maintains both high thermal conductivity and good processability
2Temperature
If magnesium oxide is used as a thermally conductive filler, then thermal conductivity is improved, but hygroscopicity increases causing reliability issues in high humidity
Solution Approach 1:
The patent applies parameter changes by controlling the specific surface area of magnesium oxide particles to be 0.01 to 0.5 m²/g. This parameter optimization reduces the hygroscopicity of magnesium oxide while maintaining its thermal conductivity, thereby improving reliability in high humidity environments
Solution Approach 2:
The patent uses aluminum hydroxide as an alternative filler that copies the thermal conductivity function of magnesium oxide but with superior moisture resistance. Aluminum hydroxide provides similar thermal performance without the hygroscopicity issues
3Temperature
If aluminum oxide is used as a thermally conductive filler, then thermal conductivity is improved, but equipment wear increases due to high Mohs hardness
Solution Approach 1:
The patent replaces durable but harmful aluminum oxide with magnesium oxide and aluminum hydroxide fillers. These alternative materials provide comparable thermal conductivity with significantly reduced equipment wear, effectively substituting a 'harmful' material with beneficial alternatives
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The composition exhibits excellent moldability, thermal conductivity of 3.5 W/m·K or more, specific gravity of 3.1 g/cm3 or less, and maintains hardness without significant increase after high humidity testing, ensuring reliable performance.
Implementation Method 1
a thermally conductive silicone resin composition which may be used as a heat transfer material which is preferably used for the cooling of electronic components by thermal conduction
Implementation Method 2
a catalytic amount of an addition reaction catalyst
Data Source
AI summary
One of the objects of the present invention is to provide a thermally conductive silicone resin composition which has good thermal conductivity, a light weight (namely, a light weight per unit volume), and good reliability in high humidity, and a molded body thereof. The present invention provides a thermally conductive silicone resin composition comprising the following components (A) to (E): (A) an organopolysiloxane having at least two alkenyl groups each bonded to a silicon atom in an amount of 100 parts by mass, (B) an organohydrogen polysiloxane having at least two hydrogen atoms each bonded to a silicon atom in an amount such that a ratio of the number of the hydrogen atom bonded to a silicon atom relative to the number of the alkenyl group in component (A) is 0.1 to 2, (C) a thermally conductive filler in an amount of 2500 to 6000 parts by mass, (D) a catalytic amount of an addition reaction catalyst, and (E) an addition-reaction controlling agent in an amount of 0.01 to 1 part by mass, wherein the thermally conductive filler (C) comprises magnesium oxide having a specific surface area of 0.4 m2/g or less in an amount of 20 to 50 wt % and aluminum hydroxide in an amount of 10 to 30 wt %, relative to a total weight of component (C).