Curable Silicone Composition Balancing Liquid Handling and Hardness
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Current curable silicone compositions either lack adhesion to difficult-to-adhere materials like polyphenylsulfone resin or cannot be handled as liquids at room temperature, limiting their application in semiconductor and optical devices.
Innovation Solution
A curable silicone composition comprising an organopolysiloxane resin with a carbon-carbon double bond, a linear organopolysiloxane, and a curing agent, with specific mass % ranges and viscosity, allowing for liquid handling at room temperature and achieving excellent adhesion and mechanical properties in the cured product.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If hot-melt curable silicone sheet composition is used to achieve hardness and adhesion, then mechanical properties are improved, but the composition becomes solid at room temperature and cannot be handled as liquid
Solution Approach 1:
The patent resolves the contradiction between hardness and handleability by controlling the molecular weight and composition parameters of the polyorganosiloxane components. By using alkenyl group-containing linear polyorganosiloxane as the main component (50-90 mass%) and carefully selecting the ratios of resinous components, the composition achieves a liquid state at room temperature with sufficient viscosity control, while the curing process produces a hard, mechanically strong cured product. This parameter optimization allows liquid handling before curing and hardness after curing.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The composition can be used as a liquid at room temperature, providing excellent adhesion to various base materials, including difficult-to-adhere ones, and exhibits sufficient mechanical strength and hardness, making it suitable for semiconductor applications and other industrial uses.
Implementation Method 1
a curable silicone composition containing an organopolysiloxane resin having a curing reactive functional group (A1), an organopolysiloxane resin not having the curing reactive functional group (A2), and a linear organopolysiloxane in a liquid state at 25° C. having a curing reactive functional group (B), and a curing agent (C)
Data Source
AI summary
Provided is a curable silicone composition that can be handled as a liquid at room temperature, where a cured product thereof has excellent adhesive and mechanical properties and exhibits relatively high hardness. The curable silicone composition comprises: (A1) an organopolysiloxane resin having a curing reactive functional group that contains a carbon-carbon double bond, (A2) an organopolysiloxane resin not having the curing reactive functional group, and (B) a linear organopolysiloxane in a liquid state at 25° C. having the curing reactive functional group, in specific mass % ranges, as well as (C) a curing agent. The viscosity of the entire composition is 50 Pa·s or less, and the amount of the curing reactive functional groups in 100 g of the composition is 1.5 mol % or more. Also provided is a cured product of the composition, and a use thereof in a semiconductor application and the like.