Curable Silicone Composition for Low-CTE Flexible Semiconductor Molding
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Solution Overview
Problem
Current curable silicone compositions for semiconductor applications face challenges in achieving both high heat resistance and color stability while maintaining hot-melt properties and mechanical strength, particularly at elevated temperatures, and struggle with flexibility and stress relief properties due to the trade-off between hardness and thermal expansion.
Innovation Solution
A curable silicone composition comprising organopolysiloxane resins with specific siloxane units and functional fillers, where the content of vinyl groups is controlled within a certain range, along with curing agents and a hydrosilylation reaction catalyst, to achieve hot-melt properties and improved flexibility and stress relief, even with high filler content, and is processed at temperatures not exceeding 50°C for efficient molding.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If phenyl silicone resin is used to achieve hot-melt properties and mechanical strength, then hot-melt properties and strength are improved, but coloring occurs at high temperatures and light reflectance decreases
Solution Approach 1:
The patent changes the chemical composition parameters by using methyl silicone resin instead of phenyl silicone resin, and carefully controls the vinyl group content (0.05-1.50 mol%) to achieve the desired balance between hot-melt properties and color stability at high temperatures
Solution Approach 2:
The patent creates a composite material system combining methyl silicone resin with specific functional fillers (inorganic fillers without coarse particles) and controlled vinyl group-containing components to achieve both hot-melt properties and color resistance simultaneously
2Stability of the object's composition
If inorganic filler content is increased to reduce coefficient of thermal expansion, then thermal expansion is reduced, but hardness increases and flexibility and stress relief properties decrease
Solution Approach 1:
The patent optimizes the particle size distribution parameter of inorganic fillers (using fine particles without coarse particles) and controls the vinyl group content to achieve a balance where the cured product has reduced thermal expansion while maintaining flexibility and stress relief properties
Solution Approach 2:
The patent applies local quality by ensuring uniform distribution of fine inorganic filler particles throughout the silicone resin matrix, creating consistent local properties that provide both thermal stability and flexibility throughout the material
3Ease of manufacture
If organic solvent is used in mixing process, then mixing is facilitated, but solvent removal requires heat application and residual solvent remains, limiting sheet thickness
Solution Approach 1:
The patent extracts and eliminates the organic solvent from the composition system entirely, using a solvent-free mixing process that combines silicone resin and inorganic fillers directly, thereby avoiding solvent removal steps and residual solvent issues
Solution Approach 2:
The patent replaces the organic solvent (which requires expensive removal processes and leaves harmful residues) with a simple mechanical mixing approach that requires no solvent removal and leaves no harmful residues
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The composition provides a cured product with excellent hot-melt properties, flexibility, and stress relief, along with a small coefficient of thermal expansion, enabling its use in semiconductor devices and other applications with enhanced mechanical properties and color stability.
Implementation Method 1
a hydrosilylation reaction catalyst
Data Source
AI summary
Provided is a curable silicone composition and applications thereof. The composition has hot-melt properties as a whole, superior workability and curing characteristics such as overmolding, as well as superior flexibility and stress relief properties of a cured product thereof, even when a relatively large amount of filler is blended. Also provided is a cured product with a relatively small coefficient of thermal expansion. A curable silicone composition, comprising: an organopolysiloxane resin where 20 mol % or more of the total siloxane units of the organopolysiloxane resin is siloxane units represented by SiO4/2; and one or more functional fillers. A vinyl (CH2═CH—) group content of curing reactive functional groups containing carbon-carbon double bonds is 0.05 to 1.50 mol % per 100 g of silicone component(s) in the composition.