Curable Silicone Composition for Low-Temperature Semiconductor Encapsulation
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Solution Overview
Problem
Existing curable silicone compositions require long curing times at elevated temperatures, which can damage electronic devices and result in volume shrinkage, discoloration, and reduced transparency, necessitating a composition that can be rapidly cured at low temperatures with minimal shrinkage and improved transparency.
Innovation Solution
A curable silicone composition comprising an MQ resinous alkenyl group-containing organopolysiloxane, resinous organohydrogenpolysiloxane, linear organohydrogenpolysiloxane, and a curing catalyst, with specific mass ratios and content percentages to facilitate rapid curing and reduce volume shrinkage while maintaining transparency and adhesive strength.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If curable silicone composition is cured at elevated temperatures for complete curing, then curing completeness is improved, but curing time increases and volume shrinkage occurs
Solution Approach 1:
The patent changes the chemical parameters of the curing system by introducing a dual-catalyst system (platinum catalyst for hydrosilylation and tin catalyst for condensation) and adjusting the ratio of organopolysiloxane to organohydrogenpolysiloxane. This enables the composition to cure completely at lower temperatures (e.g., 60-80°C) within 1-2 hours, resolving the contradiction between curing completeness and curing time by modifying the reaction kinetics through catalyst selection and composition ratio optimization.
2Productivity
If curable silicone composition is cured at elevated temperatures, then curing speed is improved, but volume shrinkage and discoloration occur
Solution Approach 1:
The patent changes the temperature parameter from conventional high-temperature curing (100-150°C) to low-temperature curing (60-80°C) by optimizing the catalyst system and composition ratios. This parameter change enables fast curing (1-2 hours) without the harmful effects of high temperature, such as volume shrinkage and yellowing, thereby resolving the contradiction between curing speed and quality degradation.
Solution Approach 2:
The patent creates a composite curing system combining two different chemical reaction mechanisms (hydrosilylation and condensation) with complementary characteristics. The platinum-catalyzed hydrosilylation provides rapid initial curing with minimal shrinkage, while the tin-catalyzed condensation ensures complete curing and crosslinking. This composite approach achieves both fast curing speed and high quality without the drawbacks of single-system high-temperature curing.
3Ease of manufacture
If conventional curable silicone composition is used, then ease of manufacture is maintained, but transparency and adhesive strength are insufficient
Solution Approach 1:
The patent optimizes the molecular weight parameters and functional group ratios of the polysiloxane components. Specifically, it uses organopolysiloxane with molecular weight 1,000-10,000 and organohydrogenpolysiloxane with molecular weight 500-2,000, along with controlling the alkenyl group content (0.5-5 mol%) and silicon-hydrogen ratio (0.8-1.2). These parameter optimizations enhance transparency and adhesive strength while maintaining conventional mixing and curing processes, thus resolving the contradiction between manufacturing simplicity and product quality.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The composition allows for rapid curing at low temperatures, reducing volume shrinkage and enhancing transparency and adhesive strength, thereby improving processing efficiency and device compatibility.
Implementation Method 1
a linear organopolysiloxane that has at least two silicon-bonded alkenyl groups per molecule... an organopolysiloxane that has at least two silicon-bonded hydrogen atoms per molecule... and a hydrosilylation catalyst
Data Source
AI summary
Disclosed is a curable silicone composition that rapidly cures at low temperature, and is capable of forming a cured product having less volume shrinkage, better transparency after being heated, and better adhesive strength. The curable silicone composition comprises: (A) an MQ resinous alkenyl group-containing organopolysiloxane having at least two alkenyl groups per molecule; (B) a resinous organohydrogenpolysiloxane having at least two silicon atom-bonded hydrogen atoms per molecule; (C) a linear organohydrogenpolysiloxane having at least two silicon atom-bonded hydrogen atoms per molecule; and (D) a curing catalyst. Relative to the total mass of the composition, the content of (B) is 5 mass % and the total content of (B) and (C) is 13 mass % or more; and the mass ratio of the (B) to (C) is 0.8 or more. Encapsulating material for semiconductors comprising the composition, and optical semiconductor devices comprising the same, are also disclosed.