Silicone Conductive Resin Composition for Moisture-Resistant Electrodes
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Solution Overview
Problem
Conductive resin compositions containing epoxy resin as the main component lack sufficient moisture resistance and flexibility, leading to design restrictions and reduced manufacturing efficiency for electronic components in harsh environments.
Innovation Solution
A conductive resin composition is formulated with a silicone resin as the primary resin binder, accompanied by a predetermined amount of flaky metal powder and organic solvent, enhancing moisture resistance and flexibility while minimizing design restrictions.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If epoxy resin is used as the main component, then heat resistance and adhesion are improved, but design flexibility is restricted due to the need for blending with butyral resin
Solution Approach 1:
The patent extracts and removes the butyral resin component from the conventional epoxy-based conductive resin composition. By eliminating the need for butyral resin blending, the invention simplifies the composition formulation and removes the design restrictions that arose from the required flexibility adjustments, thereby improving design flexibility while reducing composition complexity.
Solution Approach 2:
The patent changes the base resin parameter from epoxy resin to silicone resin, which inherently provides the necessary flexibility without requiring additional blending components. This parameter change eliminates the complexity of multi-resin formulations while maintaining or improving design adaptability.
2Reliability
If flaky metal powder is increased to 20% or more, then conductivity and stress relaxation are improved, but manufacturing precision may be affected
Solution Approach 1:
The patent optimizes the particle morphology parameter of the metal filler by specifying flaky shapes with controlled aspect ratios. This parameter change enhances conductivity through better particle packing and contact while the controlled flakiness provides stress relaxation capabilities. The specific dimensional parameters of the flaky particles are managed to maintain manufacturing precision during the forming process.
Data Source
AI summary
A method for manufacturing an electronic component includes: a preparation step of preparing an electrode-forming body for electronic components; and an electrode forming step of forming an electrode on an outer surface of the electrode-forming body for electronic components, wherein in the electrode forming step, a conductive resin layer is formed on the electrode-forming body for electronic components by using a conductive resin composition containing a metal powder, a resin binder, and an organic solvent, wherein 20.0% by mass or more of the metal powder is a flaky metal powder, and 70.0% by mass or more of the resin binder is a silicone resin. According to the present invention, it is possible to provide a method for manufacturing an electronic component having reduced restrictions on design and manufacturing and high manufacturing efficiency, in addition to high moisture resistance.