Silicone Resin Electrode Coating for Moisture-Resistant Components
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Solution Overview
Problem
Electronic components in mobile devices and automobiles face challenges with high humidity environments, requiring improved moisture resistance and flexibility, which current conductive resin compositions with epoxy resin as the main component fail to provide, leading to design and manufacturing restrictions.
Innovation Solution
A method for manufacturing electronic components using a conductive resin composition containing silicone resin, applied via a dip method to form a conductive resin layer on electrode-forming bodies, enhancing moisture resistance and flexibility while reducing design and manufacturing restrictions.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conductive resin layer thickness is increased to improve moisture resistance, then moisture permeability decreases, but manufacturing complexity and cost increase
Solution Approach 1:
The patent changes the material parameter from epoxy resin to silicone resin, which has inherently lower moisture permeability. This material parameter change allows achieving the same or better moisture resistance with a thinner conductive resin layer, thereby simplifying manufacturing processes, reducing material usage, and lowering production costs while maintaining or improving moisture protection performance
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The method achieves high moisture resistance and flexibility for electronic components, reducing the rate of change in moisture permeability with film thickness, thereby increasing manufacturing efficiency and reducing design and manufacturing restrictions.
Implementation Method 1
applied via a dip method to form a conductive resin layer on electrode-forming bodies
Data Source
AI summary
A method for manufacturing an electronic component includes: a preparation step of preparing an electrode-forming body for electronic components; and an electrode forming step of forming an electrode on an outer surface of the electrode-forming body for electronic components, wherein in the electrode forming step, a conductive resin layer is formed on the electrode-forming body for electronic components by using a conductive resin composition containing a silicone resin. According to the present invention, it is possible to provide a method for manufacturing an electronic component having high moisture resistance. Alternatively, it is possible to provide a method for manufacturing an electronic component having reduced restrictions on design and manufacturing and high manufacturing efficiency, in addition to high moisture resistance.