Reaction-Curable Silicone Gel Laminate for Electronic Component Protection
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Solution Overview
Problem
The challenge lies in manufacturing electronic components using reaction-curable silicone gels, where the adhesion area is small, making separation from substrates difficult, leading to potential damage and defects during industrial production, especially when using certain manufacturing equipment.
Innovation Solution
A laminate comprising a reaction-curable silicone gel laminated on a substrate with a sheet-like member via an adhesive layer, allowing for simultaneous curing and separation of the silicone gel and sheet-like member from the electronic component, ensuring easy and reliable release without damaging the substrate.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the adhesion area of silicone gel on electronic component is small, then the separation process becomes difficult and may cause damage, but increasing the adhesion area may lead to excessive bonding strength that prevents clean release
Solution Approach 1:
The patent segments the bonding interface by introducing a sheet-like member with adhesive layer that interfaces with the silicone gel, while the silicone gel itself maintains limited direct contact with the electronic component. This segmentation allows the sheet-like member to bear the separation force, enabling clean release of the silicone gel from the electronic component without damage.
Solution Approach 2:
The sheet-like member with adhesive layer serves as an intermediary between the silicone gel and the external separation force. The adhesive layer bonds to the silicone gel, and the sheet-like member provides a convenient interface for separation, mediating the release process to prevent direct pulling on the silicone gel from the electronic component.
2Strength
If crosslinking density of organopolysiloxane is increased to facilitate complete curing, then curing strength improves, but the advantageous properties of silicone gel such as low elasticity and stress buffering are lost
Solution Approach 1:
The patent applies different crosslinking densities to different regions or functions: the silicone gel layer maintains low crosslinking density to preserve its stress buffering and conformability properties, while the sheet-like member with adhesive layer provides the structural strength needed for handling and separation. Each layer has optimized local properties suited to its specific function.
Solution Approach 2:
The patent creates a composite structure combining silicone gel (with low crosslinking density for stress buffering) and a sheet-like member (with higher strength properties). This composite material system allows the silicone gel to maintain its advantageous properties while the overall laminate provides sufficient strength for manufacturing and separation processes.
3Shape
If silicone gel is used to conform to uneven substrate surface, then gap filling and coverage improve, but the gel becomes susceptible to destruction by external stresses and vibrations
Solution Approach 1:
The patent segments the protective function between the silicone gel layer and the sheet-like member. The silicone gel layer conforms to the uneven substrate surface and provides gap filling, while the sheet-like member with adhesive layer provides the mechanical strength to resist external stresses and vibrations, preventing destruction of the conformable gel layer.
Solution Approach 2:
The patent creates a composite laminate where the silicone gel layer provides conformability and gap filling against uneven substrates, while the bonded sheet-like member provides structural reinforcement. This composite structure allows the gel to maintain its shape-adapting properties without being destroyed by external stresses, as the sheet-like member bears those stresses.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method provides a gel layer with excellent heat resistance, flexibility, and stress buffering properties that change to a hard layer post-curing, enabling easy and reliable separation from substrates, reducing defects in electronic components and final products.
Implementation Method 1
a reaction-curable silicone gel which experiences a change in physical properties from a soft gel layer having superior shape retention on an electronic component to a hard cured layer after a curing reaction
Implementation Method 2
a sheet-like member laminated via an adhesive layer on the gel
Data Source
AI summary
[Problem] To provide a laminate having a gel layer on a substrate able to protect the substrate during various types of processing used in industrial production steps prior to curing, the gel layer having excellent heat resistance, softness and flexibility, a low modulus of elasticity, low stress, excellent stress buffering properties, and electronic component retention properties, and the gel layer having higher shape retention before curing but changing after curing into a hard layer having excellent release properties, the laminate being easily and readily releasable from the substrate even when the cured layer is localized, and to provide applications thereof (such as an electronic component manufacturing method). [Solution] A laminate comprising a laminated reaction-curable silicone gel and a sheet-like member laminated via an adhesive layer on top of the reaction-curable silicone gel, and a use thereof.