Thermally Conductive Silicone Grease With Strong Chip Adhesion
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Solution Overview
Problem
Conventional silicone greases exhibit insufficient thermal conductivity and adhesiveness, particularly when a large amount of heat conductive filler is included, leading to poor heat dissipation and potential peeling of semiconductor chips.
Innovation Solution
A silicone composition comprising an aliphatic unsaturated hydrocarbon group-containing organopolysiloxane, hydrolyzable organopolysiloxane, heat conductive fillers, and a platinum group metal catalyst, which forms a crosslinked structure to enhance adhesiveness and thermal conductivity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a large amount of heat conductive filler is added to improve thermal conductivity, then thermal conductivity increases, but adhesiveness decreases
Solution Approach 1:
The patent changes the chemical composition parameters of the polysiloxane base resin, specifically using a polysiloxane with terminal vinyl groups and incorporating silane-modified polysiloxane. This chemical parameter change enables the system to achieve both high thermal conductivity (up to 8.0 W/mK) and good adhesiveness simultaneously, resolving the trade-off between filler content and bonding performance
Solution Approach 2:
The patent creates a composite grease system by combining heat conductive fillers (such as aluminum nitride, aluminum oxide, or boron nitride) with a specifically formulated polysiloxane base resin containing vinyl groups and silane-modified components. This composite approach allows the filler to provide thermal conductivity while the polysiloxane matrix maintains adhesiveness, achieving both goals simultaneously
2Ease of operation
If conventional silicone grease is used to fill gaps between heat generating member and cooling member, then ease of application is improved, but thermal conductivity remains insufficient
Solution Approach 1:
The patent modifies the thermal conductivity parameter of the grease by incorporating high thermal conductivity fillers (aluminum nitride, aluminum oxide, or boron nitride) into the polysiloxane base, achieving thermal conductivity of up to 8.0 W/mK while preserving the grease's applicability and gap-filling properties
Solution Approach 2:
The patent creates a multi-functional grease that simultaneously provides ease of application (gap filling), high thermal conductivity (up to 8.0 W/mK), and good adhesiveness. The polysiloxane base resin with vinyl groups and silane modification enables the grease to perform multiple functions: filling gaps, conducting heat efficiently, and bonding to surfaces
3Reliability
If adhesion performance is improved to prevent peeling, then reliability is improved, but thermal conductivity may be compromised
Solution Approach 1:
The patent changes the chemical structure parameters of the base resin by incorporating silane-modified polysiloxane and vinyl-containing polysiloxane. This enables the resin to form strong adhesive bonds while simultaneously accommodating high thermal conductivity fillers, achieving both adhesion performance and thermal conductivity of up to 8.0 W/mK
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The composition achieves high thermal conductivity and good adhesiveness, even with a large amount of heat conductive filler, ensuring effective heat dissipation and preventing peeling of semiconductor chips.
Implementation Method 1
a platinum group metal catalyst
Implementation Method 2
forms a crosslinked structure to enhance adhesiveness and thermal conductivity
Implementation Method 3
a heat conductive filler... provides a silicone grease having a high thermal conductivity
Data Source
AI summary
As a silicone composition that can provide a silicone grease having a high thermal conductivity and excellent adhesiveness as compared to conventional silicone greases, provided is a silicone composition comprising: (A) an organopolysiloxane having at least two aliphatic unsaturated hydrocarbon groups per molecule and having a kinematic viscosity of 60-100,000 mm2/s at 25°C; (B) a hydrolyzable organopolysiloxane represented by general formula (1); (C) at least one thermally conductive filler selected from the group consisting of metal oxides or metal nitrides; (D) an organohydrogen polysiloxane represented by general formula (2); (E) an organohydrogen polysiloxane represented by general formula (3); (F) a hydrolyzable organopolysiloxane represented by general formula (4); (G) a platinum group metal catalyst; and (H) a reaction control agent.