Thermal Conductive Silicone Composition for Heat and Shift Resistance
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Solution Overview
Problem
Existing thermal conductive materials for semiconductor elements face challenges in achieving both high thermal conductivity and shift resistance, with previous compositions either lacking sufficient thermal conductivity or exhibiting poor adhesion and stability under thermal shock and vibration.
Innovation Solution
A thermal conductive silicone composition comprising specific sizes and shapes of aluminum nitride and zinc oxide particles, along with organopolysiloxane and other additives, to enhance thermal conductivity and shift resistance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If the viscosity of heat-dissipating grease is lowered to ensure desirable coating performance, then coating performance is improved, but the grease slips off due to thermal shock or vibration, resulting in insufficient heat dissipation
Solution Approach 1:
The patent uses a composite filler system combining aluminum nitride particles (high thermal conductivity) with zinc oxide particles (specific size range 0.1-4.0 μm). This composite structure allows the grease to achieve both low viscosity for good coating performance and high shift resistance through the synergistic effect of the filler combination and size distribution.
Solution Approach 2:
The patent specifies precise particle size parameters for zinc oxide (0.1-4.0 μm) and aluminum nitride particles, as well as their weight ratios (zinc oxide: 20-50 wt%, aluminum nitride: 50-80 wt%). By optimizing these parameters, the composition achieves the desired balance between coating performance and shift resistance.
2Power
If heat-dissipating grease is used for high heat generation semiconductors, then heat dissipation performance is improved, but the grease may slip off under thermal shock or vibration
Solution Approach 1:
The combination of aluminum nitride (high thermal conductivity material) and zinc oxide (stability-providing material with specific particle size) creates a composite grease that simultaneously achieves high heat dissipation performance and stability under thermal shock and vibration conditions.
Solution Approach 2:
The patent assigns different functional roles to different filler components: aluminum nitride particles provide thermal conductivity while zinc oxide particles in the specific size range provide structural stability and prevent slippage. This functional differentiation resolves the contradiction between heat dissipation and stability.
3Power
If existing thermal conductive compositions are used, then thermal conductivity is achieved, but shift resistance is insufficient
Solution Approach 1:
The patent creates a composite filler system where aluminum nitride provides high thermal conductivity and zinc oxide particles in the specific size range (0.1-4.0 μm) provide shift resistance. This composite approach simultaneously achieves both thermal conductivity of 7.5 W/m·K or more and sufficient shift resistance.
Solution Approach 2:
By precisely controlling the particle size parameters (zinc oxide: 0.1-4.0 μm, aluminum nitride: specific size ranges) and their weight ratios, the patent optimizes the balance between thermal conductivity and shift resistance, achieving both performance targets simultaneously.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The composition achieves thermal conductivity of 7.5 W/m·K or more with improved shift resistance, ensuring effective heat dissipation and stability under mechanical stress.
Implementation Method 1
thermal conductivity is lowered because of the presence of air, which is poor in thermal conduction property... heat-dissipating grease or heat-dissipating sheets, have been used... thermal conductivity of 7.5 W/m·K or more
Data Source
AI summary
The present invention is a thermal conductive silicone composition comprises (C) one or more aluminum nitride particles selected from an irregular-shaped, a round, and a polyhedral particles having an average particle size of 4 µm or more and less than 50 µm; (D) one or more aluminum nitride particles selected from an irregular-shaped, a round, and a polyhedral particles having an average particle size of 50 µm or more and 150 µm or less; and (E) an inorganic particle having an average particle size of 0.1 µm or more and less than 4.0 µm. This provides a thermal conductive silicone composition ensuring both high thermal conductivity and shift resistance.