Solvent-Free Silicone Insulating Tape Curing
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Solution Overview
Problem
Current methods for forming electrical insulating tape from silicone compositions are labor-intensive and inefficient, requiring multiple ovens and solvents that lead to the emission of volatile organic compounds and limitations in handling and application due to partially cured intermediates.
Innovation Solution
A method of forming a curable adhesive tape from a silicone composition that is substantially free from solvents, comprising alkenyl siloxane, hydrogen siloxane, a metallic hydrosilylation catalyst, and an initiating agent, which is applied to a flexible substrate, heated to form a partially cured intermediary that can be easily handled and stored without refrigeration, and further cured on a conductive substrate to form an insulating layer with excellent dielectric properties.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If multiple ovens are used to cure the reaction intermediary, then the insulating tape can be fully cured, but the device complexity and manufacturing cost increase
Solution Approach 1:
The curing process is divided into two distinct stages: first, a moisture-cure reaction at room temperature or elevated temperature forms a partially cured insulating layer; second, a steam autoclave process completes the curing. This segmentation allows each stage to be optimized independently, reducing the need for multiple sequential ovens while ensuring complete curing.
Solution Approach 2:
A moisture-cure reaction is introduced as an intermediary step between application and final steam curing. This intermediate curing stage allows the insulating layer to achieve sufficient strength for handling and positioning before the final autoclave curing, enabling a more streamlined process flow.
2Productivity
If the fiberglass cloth is passed through the vertical oven at high speed, then productivity increases, but the solvent cannot be sufficiently evaporated
Solution Approach 1:
The solvent is extracted and removed from the reaction intermediary formulation. The patent uses a solvent-free or low-solvent silicone composition that cures via moisture-cure reaction and/or steam autoclave curing, eliminating the need for high-temperature solvent evaporation and allowing high-speed processing without compromising material performance.
3Object-generated harmful factors
If solvent is burned from volatile organic compounds, then emissions are controlled, but the process becomes cost and resource intensive
Solution Approach 1:
The patent converts the traditional harmful solvent-based process into a beneficial moisture-cure or steam-cure process. By using silicone compositions that cure through moisture-cure reaction or steam autoclave curing, the process eliminates VOC emissions entirely while utilizing water or steam as the curing medium, transforming an environmental problem into a sustainable solution.
4Ease of operation
If the partially cured reaction intermediary is refrigerated to prevent full curing, then the insulating tape remains applicable, but the process complexity and storage cost increase
Solution Approach 1:
The insulating layer is applied to the conductive substrate in a partially cured state using moisture-cure reaction or steam autoclave curing, and then the remaining curing is completed in a second steam autoclave process. This preliminary curing action allows the tape to be applied and positioned before final curing, eliminating the need for refrigeration to prevent premature full curing.
5Manufacturing precision
If multiple zones or stages are used in the vertical oven, then the reaction intermediary can be properly cured, but the manufacturing precision and process control complexity increase
Solution Approach 1:
The patent changes the curing parameters by using moisture-cure reaction at room temperature or elevated temperature followed by steam autoclave curing. This parameter change simplifies the process control compared to multiple precisely controlled oven zones, as the moisture-cure stage can occur at simpler temperature conditions and the steam autoclave provides uniform curing throughout.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method eliminates the need for multiple ovens and solvents, allowing for efficient handling and storage of the tape, reduces volatile organic compound emissions, and achieves excellent adhesion and dielectric properties in the insulating layer on conductive substrates.
Implementation Method 1
a metallic hydrosilylation catalyst, and an initiating agent
Implementation Method 2
heating the silicone composition to a temperature of from 118 to 128°C for a first period of time
Implementation Method 3
an insulating layer with excellent dielectric properties
Data Source
Figure 1A
Figure 1B
Figure 1C
AI summary
A method of forming a curable adhesive tape comprising a partially cured reaction intermediary comprises applying a silicone composition onto a flexible substrate. The method further comprises heating the silicone composition to a first desired temperature for a first period of time to form the partially cured reaction intermediary of the curable adhesive tape. A method of forming an insulating layer on a conductive substrate utilizes the same steps as the method of forming the curable adhesive tape and further comprises the steps of disposing the flexible substrate on the conductive substrate and further heating the partially cured reaction intermediary to a second desired temperature for a second period of time to form the insulating layer on the conductive substrate.