Silicone-Modified Epoxy Encapsulant for Optical Semiconductor Gas Barrier
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional encapsulating compositions for optical semiconductor elements, such as those using epoxy resin or silicone resin, face issues like yellowing due to blue or ultraviolet light exposure, high water absorption, poor adhesiveness, and gas permeability, leading to reliability concerns under heat and humidity.
Innovation Solution
A composition comprising a silicone-modified epoxy compound, a curing agent, and a polyhydric alcohol, with an alkyl chain introduced in the cross-linked structure, which enhances gas barrier properties and curability in thin films, ensuring reliable encapsulation of optical semiconductor elements.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Illumination intensity
If conventional transparent epoxy resin is used for encapsulation, then good initial transparency is achieved, but yellowing occurs over time due to blue or ultraviolet light exposure
Solution Approach 1:
The patent uses a composite material system consisting of organopolysiloxane (silicone resin) combined with specific additives including hindered amine light stabilizers and ultraviolet absorbers. This composite approach provides both initial transparency and long-term resistance to yellowing under blue and ultraviolet light exposure, resolving the contradiction between initial light transmission and durability.
2Strength
If silicone resin composition is used to improve toughness and adhesiveness, then surface tackiness and dust collection occur
Solution Approach 1:
The patent modifies the silicone resin composition by adjusting crosslinking density and incorporating specific additives that alter surface properties. This changes the physical parameters of the cured resin to achieve non-tacky surface while maintaining internal toughness and adhesiveness, resolving the contradiction between strength and surface quality.
3Object-affected harmful factors
If high hardness silicone resin is used to reduce surface tackiness, then toughness and adhesiveness deteriorate
Solution Approach 1:
The patent applies local quality differentiation within the resin system by using dual-crosslinking mechanisms and additives that create distinct properties in different regions or aspects of the material. The bulk maintains toughness and adhesiveness while the surface achieves non-tacky characteristics, resolving the contradiction between surface quality and overall strength.
4Reliability
If epoxy resin composition is used to achieve good curability, then gas permeability increases leading to poor moisture resistance
Solution Approach 1:
The patent introduces organopolysiloxane as an intermediary material that modifies the epoxy resin system. The silicone resin component reduces gas permeability and improves moisture resistance while maintaining the good curability characteristics of the epoxy system, resolving the contradiction between curability and gas barrier properties.
5Ease of manufacture
If conventional resin compositions are used for encapsulation, then manufacturing simplicity is maintained, but reliability under heat and humidity conditions deteriorates
Solution Approach 1:
The patent develops a multi-functional resin composition that simultaneously provides encapsulation, adhesion, moisture barrier, and heat resistance properties in a single material system. This universal composition maintains manufacturing simplicity while delivering superior reliability under heat and humidity conditions, resolving the contradiction between ease of manufacture and environmental resistance.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The composition achieves low gas permeability, excellent curability in thin films, and improved light transmission, providing enhanced reliability and durability for optical semiconductor elements.
Implementation Method 1
an alkyl chain introduced in a cross-linked structure of a cured product enables a cured product to attain a low gas permeability
Implementation Method 2
a composition comprising a silicone-modified epoxy compound (A), a curing agent (B) and a polyhydric alcohol (C)
Data Source
AI summary
The present invention has a purpose of providing an epoxy composition for encapsulating an optical semiconductor element which composition provides a cured product having a low gas permeability and excellent curability in a form of a thin film together with good light transmission and crack resistance. The present invention provides a composition comprising (A) a silicone-modified epoxy compound represented by the formula (1), (B) a curing agent and (C) a polyhydric alcohol. The present invention further provides a composition comprising a composition prepared by reacting (A) the silicone-modified epoxy compound, (B) the curing agent and (C) the polyhydric alcohol and (D) a curing catalyst, and a cured product thereof.