Silicone-Modified Epoxy Resin for Low Gas Permeability
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Solution Overview
Problem
Conventional silicone resin compositions for photosemiconductor element sealing exhibit high gas permeability, making them unsuitable for applications requiring low gas permeability, and they often compromise on adhesiveness and mechanical strength.
Innovation Solution
A silicone-modified epoxy resin composition is developed, featuring a branched structure with specific aromatic and aliphatic hydrocarbon groups, which is produced through an epoxidation reaction of an olefin-based compound using a polyacid compound and a quaternary ammonium salt, resulting in a cured product with improved low gas permeability and mechanical strength.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If silicone resin is used to provide flexibility and UV resistance, then the cured product does not absorb UV and has flexibility, but gas permeability becomes very high
Solution Approach 1:
The patent uses composite materials by combining silicone resin with epoxy resin in a specific ratio (silicone resin:epoxy resin = 95:5 to 50:50 by weight). This composite approach allows the cured product to inherit the UV resistance and flexibility from silicone resin while the epoxy resin component reduces gas permeability, thus resolving the contradiction between UV resistance and gas permeability.
Solution Approach 2:
The patent changes the compositional parameters by controlling the silicone resin content within a specific range (50-95 parts by weight per 100 parts epoxy resin) and adjusting the molecular weight and structure of the silicone resin. By optimizing these parameters, the cured product achieves both low gas permeability and high UV resistance.
2Strength
If silicone content is increased to improve flexibility and UV resistance, then the cured product has better flexibility, but it becomes more difficult to achieve low gas permeability
Solution Approach 1:
The patent optimizes the silicone resin content parameter within a specific range (50-95 parts by weight per 100 parts epoxy resin) and controls the molecular weight of the silicone resin (average molecular weight of 1,000-100,000). By precisely controlling these parameters, the cured product achieves optimal balance between flexibility and gas permeability.
3Reliability
If conventional silicone resin composition is used, then UV resistance is achieved, but adhesiveness and mechanical strength are compromised
Solution Approach 1:
The patent creates a composite material system combining silicone resin with epoxy resin and curing agents. The epoxy resin component provides excellent adhesiveness and mechanical strength, while the silicone resin provides UV resistance. This composite approach resolves the contradiction between UV resistance and mechanical strength/adhesiveness.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The silicone-modified epoxy resin composition achieves excellent low gas permeability and mechanical strength, enhancing the performance of photosemiconductor element sealing while maintaining transparency and adhesiveness.
Implementation Method 1
produced through an epoxidation reaction of an olefin-based compound using a polyacid compound and a quaternary ammonium salt
Data Source
AI summary
The purpose of the present invention is to provide a silicone-modified epoxy resin which produces a cured product having excellent low gas permeability and strength; a composition of the resin; and an epoxy resin cured product obtainable by curing the composition.Disclosed is an epoxy resin represented by the following Formula (1):wherein R1 independently represents a monovalent aromatic hydrocarbon group having 6 to 12 carbon atoms; R2 independently represents a monovalent aliphatic hydrocarbon group having 1 to 12 carbon atoms; R3 independently represents a monovalent aliphatic hydrocarbon group having 1 to 12 carbon atoms or a monovalent aromatic hydrocarbon group having 6 to 12 carbon atoms; R4 represents an oxygen atom or a divalent hydrocarbon group having an aliphatic cyclic structure; R5 represents silicone chain having a norbornane epoxy structure at either end; and X represents an organic group having a norbornane epoxy group.