Silicone-Modified Polyimide Resin Composition for Adhesion
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Solution Overview
Problem
Polyimide resins face challenges in being solvent-free, exhibiting thixotropic properties, and achieving effective adhesion to polyolefins while maintaining low elastic modulus and preventing drooling and bubble entrapment during application.
Innovation Solution
A silicone-modified polyimide resin composition that is solvent-free, thixotropic, and capable of hardening with UV or visible light, comprising specific components such as a silicone-modified polyimide resin, polymerizable compounds, polymerization initiators, hydrophobic fumed silica, and adhesion auxiliary agents, which ensures improved adhesion to polyolefins and prevents drooling and bubble entrapment.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If polyimide resin is used as a solvent-free adhesive or coating material, then it provides good heat resistance and electrical insulating properties, but it is difficult to achieve thixotropic properties and uniform application without drooling or cobwebbing
Solution Approach 1:
The patent creates a composite material system by combining polyimide resin with silicone-modified components and inorganic fillers. This composite approach allows the adhesive to exhibit both the heat resistance of polyimide and the thixotropic properties needed for uniform application, resolving the contradiction between reliability and ease of operation
Solution Approach 2:
The patent modifies the physical and chemical parameters of the polyimide resin by incorporating silicone-modified polyimide resin and controlling the molecular weight and structure. These parameter changes enable the resin to display thixotropic behavior while maintaining its inherent heat resistance and electrical insulating properties
2Reliability
If polyimide resin is filled heavily with inorganic compounds to improve adhesion to polyolefins, then adhesion is enhanced, but bubble entrapment and nonuniformity occur during application
Solution Approach 1:
The patent utilizes inorganic fillers with controlled pore structures that can absorb excess resin and facilitate bubble release during application. This porous material approach allows heavy filling for improved adhesion while preventing bubble entrapment and maintaining uniformity
Solution Approach 2:
The patent optimizes the particle size distribution, shape, and surface properties of inorganic fillers to achieve a balance between adhesion enhancement and application uniformity. By carefully controlling these parameters, the adhesive can be heavily filled without causing bubble entrapment or nonuniformity
3Ease of operation
If polyimide resin is formulated to be fluid at normal temperature for easy application, then handleability is improved, but drooling and cobwebbing occur during application
Solution Approach 1:
The patent introduces thixotropic properties to the adhesive, making its viscosity dynamic rather than static. The adhesive remains fluid during application for good handleability but increases in viscosity when at rest, preventing drooling and cobwebbing. This dynamic viscosity change resolves the contradiction between ease of operation and harmful effects
Solution Approach 2:
The patent modifies the rheological parameters of the polyimide resin by incorporating silicone-modified components and inorganic fillers. These changes enable the resin to exhibit shear-thinning behavior, being fluid under application stress but viscous at rest, thus preventing drooling while maintaining handleability
4Reliability
If polyimide resin is cured by high temperature treatment to achieve complete curing, then curing is effective, but the process is time-consuming and requires high energy input
Solution Approach 1:
The patent replaces the thermal curing mechanism with a photochemical curing mechanism using photopolymerization initiators that activate under UV or visible light. This substitution allows effective curing at low temperatures and short times, dramatically reducing both curing time and energy input while maintaining curing effectiveness
Solution Approach 2:
The patent introduces photopolymerization initiators and modifies the molecular structure to enable photo-curing. This fundamental change in the curing mechanism parameters allows the resin to cure effectively under UV or visible light at room temperature, eliminating the need for high temperature and long duration thermal treatment
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The composition provides a fluid and handleable silicone-modified polyimide resin that hardens upon irradiation, offering superior adhesion to polyolefins with a low elastic modulus, preventing drooling and bubble entrapment, and ensuring uniform application and improved coating properties.
Implementation Method 1
the composition... by capability of hardening on irradiation with ultraviolet rays and/or visible rays
Implementation Method 2
The composition has thixotropic properties despite its fluidity at normal temperature
Data Source
AI summary
Disclosed herein is a silicone-modified polyimide resin composition of solvent free type. The composition is suitable for use as an adhesive and a coating material which are capable of hardening upon irradiation with ultraviolet rays and/or visible rays. Also, it is saved from drooling even in the case of light filling with an inorganic compound and it is saved from bubble entrapment and nonuniformity at the time of application with heavy filling. It further exhibits good moldability due to its thixotropic properties. Moreover, it exhibits improved adhesion to polyolefin resins without impairing the past properties. Finally, it gives rise to a cured product which is not excessively hard, with a low elastic modulus, despite filling with an inorganic compound. The composition of the present invention includes components (A) to (B) listed below and is characterized by being fluid at 25° C. and free of solvent:(A) silicone-modified polyimide resin;(B) polymerizable compound;(C) polymerization initiator,(D) hydrophobic fumed silica; and(E) adhesion auxiliary agent.