Silicone Skeleton Polymer for Fine Patterning and Adhesion
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Solution Overview
Problem
Existing silicone skeleton-containing polymers used in photo-curable resin compositions for protecting electric and electronic parts face challenges in forming fine patterns with large film thickness, achieving excellent adhesion and crack resistance, and maintaining reliability under heat cycles.
Innovation Solution
A silicone skeleton-containing polymer with a specific molecular weight range and crosslinking groups, combined with a photo-acid generator, crosslinking agent, and solvent, to form a photo-curable resin composition that can be easily patterned and cured, providing excellent adhesion, crack resistance, and heat resistance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If photosensitive silicone composition with silphenylene skeleton is used to improve chemical resistance, then chemical resistivity to photoresist stripper improves, but the cured material can be delaminated from substrate or develop cracks under heat cycle conditions
Solution Approach 1:
The patent modifies the chemical composition parameters of the silicone polymer by incorporating specific functional groups (epoxy, carboxyl, hydroxyl, amino) and controlling the siloxane bond content (60-80 atom %) to achieve optimal balance between chemical resistance and adhesion stability. This compositional parameter adjustment allows the material to maintain both improved chemical resistivity and reliable substrate bonding under thermal cycling conditions.
Solution Approach 2:
The invention creates a composite polymer system combining siloxane backbone with multiple functional groups (epoxy, carboxyl, hydroxyl, amino) that work synergistically. The siloxane provides chemical resistance while the functional groups enhance adhesion and crosslinking, resulting in a composite material that simultaneously achieves both improved chemical resistance and thermal cycle stability.
2Strength
If polymer with high molecular weight is used to improve adhesion and mechanical properties, then adhesion to substrate improves, but the ability to form fine patterns with large film thickness decreases
Solution Approach 1:
The patent optimizes the molecular weight parameter to a specific range (10,000-100,000) that balances adhesion strength and pattern formation capability. This controlled molecular weight parameter ensures sufficient mechanical strength and adhesion while maintaining appropriate viscosity for forming fine patterns with large film thickness through photolithography processes.
3Temperature
If photosensitive silicone composition is used to achieve low curing temperature, then curing temperature decreases, but wet adhesion resistance becomes insufficient
Solution Approach 1:
The patent adjusts the functional group content parameters (epoxy: 1-20 mol %, carboxyl: 1-20 mol %, hydroxyl: 1-30 mol %, amino: 1-20 mol %) to enable low-temperature curing while simultaneously achieving high wet adhesion resistance. The synergistic combination of these functional groups allows the material to cure at lower temperatures without compromising adhesion reliability.
Solution Approach 2:
The invention develops a composite silicone polymer system that integrates multiple adhesion-promoting functional groups with the siloxane backbone. This composite structure enables low-temperature curing through reduced activation energy from functional groups while the crosslinked network formed by these groups provides robust wet adhesion resistance.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The resulting photo-curable resin composition enables the formation of fine patterns with large film thickness, ensuring excellent adhesion and crack resistance, and maintaining reliability even under heat cycles, making it suitable for protecting electric and electronic parts.
Implementation Method 1
a photo-acid generator (B) that is decomposed by light having a wavelength of 190 to 500 nm to generate an acid
Implementation Method 2
a silicone skeleton-containing polymer comprising a silicone skeleton shown by the following formula (1) and having a weight average molecular weight of 3,000 to 500,000
Data Source
AI summary
The present invention provides a silicone skeleton-containing polymer including a silicone skeleton shown by the following formula (1) and having a weight average molecular weight of 3,000 to 500,000. This can provide a silicone skeleton-containing polymer that can easily form a fine pattern with a large film thickness, and can form a cured material layer (cured film) that is excellent in various film properties such as crack resistance and adhesion properties to a substrate, electronic parts, and a semiconductor device, particularly a base material used for a circuit board, and has high reliability as a film to protect electric and electronic parts and a film for bonding substrates; and a photo-curable resin composition that contains the polymer, a photo-curable dry film thereof, a laminate using these materials, and a patterning process.