Liquid Silicone Pressure Dome for PCB Thermal Contact
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Solution Overview
Problem
Existing cooling devices for electrical and control devices require additional effort and cost due to the need for separate work steps to attach heat-dissipating parts, which complicates the manufacturing and assembly process.
Innovation Solution
The use of pressure domes made of liquid silicone, placed directly over elements producing power loss on the carrier plate, ensures mechanical and thermal contact with a cooling element, eliminating the need for separate heat-dissipating parts by creating a spring effect during assembly.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If heat-dissipating parts are attached to the carrier plate using separate work steps (rivets, screws, or gluing), then heat dissipation is achieved, but manufacturing complexity and cost increase
Solution Approach 1:
The patent merges the sealing function and heat dissipation function into a single integrated sealing element. The sealing element includes both sealing portions (for sealing) and heat-dissipating portions (for heat dissipation), eliminating the need for separate heat-dissipating parts and their attachment work steps. This directly resolves the contradiction by combining multiple functions into one component.
Solution Approach 2:
The sealing element is designed to perform multiple functions simultaneously: sealing the housing and dissipating heat from the carrier plate. The heat-dissipating portions of the sealing element contact the carrier plate to conduct heat away, while the sealing portions maintain the seal. This multi-functionality eliminates the need for additional dedicated heat-dissipating components.
2Temperature
If heat-dissipating parts are attached to the carrier plate in separate work steps, then thermal contact is established, but assembly time and production cost increase
Solution Approach 1:
The patent combines the sealing element installation with the heat dissipation function in a single operation. When the sealing element is installed in the housing, it simultaneously establishes thermal contact with the carrier plate through its heat-dissipating portions, eliminating the need for separate heat-dissipating parts and their attachment work steps. This directly improves assembly efficiency while maintaining effective thermal contact.
3Temperature
If additional heat-dissipating parts are used, then heat dissipation capability is improved, but manufacturing cost increases
Solution Approach 1:
The sealing element is designed to perform multiple functions simultaneously: sealing the housing and dissipating heat from the carrier plate. The heat-dissipating portions of the sealing element contact the carrier plate to conduct heat away, while the sealing portions maintain the seal. This multi-functionality eliminates the need for additional dedicated heat-dissipating components, thereby reducing manufacturing cost while maintaining heat dissipation capability.
Solution Approach 2:
The patent merges the sealing function and heat dissipation function into a single integrated sealing element. The sealing element includes both sealing portions (for sealing) and heat-dissipating portions (for heat dissipation), eliminating the need for separate heat-dissipating parts and their attachment work steps. This directly resolves the contradiction by combining multiple functions into one component.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method effectively dissipates heat loss without additional manufacturing or assembly steps, preventing overheating and reducing production costs by integrating the pressure domes with the housing seal in a single injection molding process.
Implementation Method 1
the at least one pressure dome is made of liquid silicone and is attached in the first housing part in such a way that, after the electrical device has been inserted, the electrical component is on the at least one pressure dome
Implementation Method 2
These pressure domes are preferably located in a first housing part and ensure mechanical and thermal contact of the carrier plate with a cooling element such as a second housing part
Data Source
Figure 1
Figure 2A~2C
AI summary
The device has a cooling element provided as a housing lid (5) of an electrical device. An electronic circuit is arranged on a printed circuit board (3). A pressing pin (4) is arranged above a power loss producing element (2) of the electronic circuit so that mechanical and thermal contacts to the board are ensured. The pressing-pin is manufactured by an injection molding process. The pressing-pin is produced as a seal (6) for a lower housing part (1) and the housing lid made of liquid-silicone. The pressing-pin is pressed with pressing force (F) of 100 to 200 Newton after a mounting step. An independent claim is also included for a method for manufacturing a cooling device for an electrical device.