Silicone PSA Composition for Low Peel Adhesion and Clean Removal

Resolve Bottlenecks,
Find Innovative Solutions
Generate Solutions

Solution Overview

Problem

Current silicone pressure sensitive adhesives (PSAs) used in removable protective films for electronic components and displays often require high peeling force, leave detectable residue, and exhibit slow wetting, which can damage surfaces and interfere with subsequent operations.

Innovation Solution

A silicone PSA composition comprising a linear olefinically-functional polyorganosiloxane copolymer gum, a silicone resin, and a hydrosilylation catalyst, in the substantial absence of low molecular weight siloxane, providing low peel adhesion, clean removal, and fast wetting.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If conventional silicone PSAs are used, then surface wetting and high-temperature performance are improved, but peeling force becomes excessive and residue is left on the substrate

Engineering Contradiction:
Improvesurface wetting and high-temperature performanceVSAvoidpeeling force
Core Design Contradiction:
ReliabilityVSForce

Solution Approach 1:

The patent changes the molecular weight parameter of the silicone PSA, specifically using high molecular weight silicone polymers (viscosity of 10,000-1,000,000 cP) to reduce peeling force while maintaining surface wetting and high-temperature performance. This parameter change resolves the contradiction by finding an optimal viscosity range that balances adhesion strength with removability.

Inventive Principle:
Principle #35Parameter changes

Solution Approach 2:

The patent creates a composite adhesive system by combining high molecular weight silicone polymers with specific fillers (such as fumed silica, colloidal silica, or aluminum oxide) and solvents. This composite approach maintains the superior surface wetting and thermal stability of silicone while the filler network structure reduces excessive peeling forces and prevents residue formation.

Inventive Principle:
Principle #40Composite materials

2Strength

If conventional silicone PSAs are used, then adhesion strength is improved, but clean removal from substrate is compromised

Engineering Contradiction:
Improveadhesion strengthVSAvoidclean removal
Core Design Contradiction:
StrengthVSEase of operation

Solution Approach 1:

The patent adjusts the molecular weight and viscosity parameters of the silicone PSA to achieve optimal adhesion strength that allows for clean removal. By using high molecular weight silicone polymers within a specific viscosity range and controlling the silicone content (5-50 wt%), the adhesive maintains sufficient bonding strength during use but enables clean removal without residue afterward.

Inventive Principle:
Principle #35Parameter changes

Solution Approach 2:

The patent formulates the silicone PSA as a temporary adhesive that fulfills its bonding function during the protective film's service life and then cleanly detaches without permanent residue. The adhesive is designed to be effective only for the duration needed, after which it removes completely, similar to a disposable component that serves its purpose and is then discarded without trace.

Inventive Principle:
Principle #27Cheap short-living objects (Disposable)

3Strength

If conventional silicone PSAs are used, then adhesion is improved, but bubble entrapment increases due to slow wetting

Engineering Contradiction:
ImproveadhesionVSAvoidwetting speed
Core Design Contradiction:
StrengthVSSpeed

Solution Approach 1:

The patent changes the viscosity parameter of the silicone PSA by selecting high molecular weight polymers within a specific range (10,000-1,000,000 cP) and controlling silicone content (5-50 wt%). This parameter optimization balances wetting speed and adhesion strength, enabling the adhesive to spread rapidly across the substrate while maintaining strong bonding, thereby reducing bubble entrapment during application.

Inventive Principle:
Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution achieves low peel adhesion, minimal residue, and rapid surface wetting, enhancing the usability and quality of protective films for electronic components and displays by reducing the risk of surface damage and improving post-removal surface integrity.

Implementation Method 1

Silicone PSAs are normally cured by crosslinking via either organic peroxide initiated radical reaction, 'peroxide cure' or metal catalyzed hydrosilylation, 'addition cure.'

Methodology Applied
Scientific EffectHydrosilylation: Chemical Bonding

Data Source

PatentUS9777203B2Silicone pressure sensitive adhesive compositions and protective films containing the same
Publication Date: 2017.10.03 MOMENTIVE PERFORMANCE MATERIALS INC

AI summary

There is provided herein a silicone pressure sensitive adhesive composition comprising (A) a linear olefinically-functional polyorganosiloxane copolymer gum possessing a degree of polymerization in excess of 3,000; (B) a silicone resin including at least one MH unit and at least one Q unit; and, (C) a hydrosilylation catalyst, wherein the composition is in the substantial absence of low molecular weight siloxane having a degree of polymerization of less than 3,000 and wherein the composition has low peel adhesion to and clean removal from a substrate. There is also provided a protective film including the same as well as a method of making the protective film.