Silicone Resin Optical Fiber Module Bonding
Solution Overview
Problem
The use of epoxy adhesive in optical fiber modules leads to light emission when irradiated with laser light, reducing the precision in detecting the presence/absence of disconnection in lighting devices.
Innovation Solution
The optical fiber module uses a silicone resin with siloxane bonds at cross-linking points to bond the optical fiber and ferrule, which suppresses light emission and enhances heat resistance and mechanical strength.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If epoxy adhesive is used to bond the optical fiber and ferrule, then strong bonding strength is achieved, but light emission occurs when irradiated with laser light, reducing detection precision
Solution Approach 1:
The patent changes the chemical composition parameters of the adhesive from epoxy resin to silicone resin with specific siloxane bond content. This parameter change eliminates the light emission property while maintaining bonding strength, thereby resolving the contradiction between strong bonding and detection precision.
Solution Approach 2:
The patent uses a composite adhesive material consisting of silicone resin base with added siloxane bonds. This composite material combines the benefits of strong bonding (from silicone resin) with light emission suppression (from siloxane bonds), resolving the technical contradiction.
2Reliability
If epoxy adhesive is used to bond the optical fiber and ferrule, then reliable fixation is achieved, but light emission interferes with disconnection detection
Solution Approach 1:
The patent modifies the chemical parameters of the adhesive by replacing epoxy resin with silicone resin containing siloxane bonds. This change eliminates the harmful light emission effect while preserving fixation reliability, thus resolving the contradiction.
Solution Approach 2:
The patent converts the potential harm of light emission by selecting a silicone resin material that inherently suppresses light emission. The material's siloxane bonds provide both structural integrity for reliable fixation and optical properties that prevent light emission interference.
3Stability of the object's composition
If the adhesive is irradiated with laser light, then the bonding function is maintained, but light emission reduces signal detection accuracy
Solution Approach 1:
The patent changes the material composition from epoxy to silicone resin with siloxane bonds, which alters the optical properties under laser irradiation. This parameter change maintains bonding stability while eliminating light emission that would interfere with signal detection accuracy.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The silicone resin effectively reduces light emission and improves the precision in detecting disconnections, while maintaining strong fixation and preventing damage to the optical fiber module.
Implementation Method 1
a silicone resin containing siloxane bonds at cross-linking points
Implementation Method 2
curing the liquid silicone resin by heating at a temperature of 140° C. or higher
Data Source
AI summary
An optical fiber module includes an optical fiber containing a glass component, and a ferrule which is tubular in shape and covers an outer circumferential surface in an end portion of the optical fiber. The outer circumferential surface of the optical fiber and an inner circumferential surface of the ferrule are bonded by a silicone resin containing siloxane bonds at cross-linking points.