Silicone Resin Optical Coupler for Thermal Stress Relief
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Solution Overview
Problem
Optical coupling devices face reliability issues in high temperature and high humidity environments due to peeling and thermal deterioration of the resin, particularly when using epoxy resins, which affect the device's characteristics and reliability.
Innovation Solution
The optical coupling device employs a silicone resin cured material to cover the light emitter and receiver, and fills the region between the lead frames with the same, reducing stress and maintaining reliability through lower expansion coefficients and elastic modulus variation, thereby minimizing peeling and thermal deterioration.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If epoxy resin is used to cover the optical element, then the device structure is formed, but peeling and thermal deterioration occur in high temperature and high humidity environments
Solution Approach 1:
The patent changes the material parameter from epoxy resin to silicone resin, which has fundamentally different thermal and mechanical properties. Silicone resin maintains its elasticity and adhesion across a wider temperature range, preventing the peeling and thermal deterioration that occurs with epoxy resin in high temperature and high humidity environments.
Solution Approach 2:
The patent employs silicone resin as a composite material that combines flexibility, thermal stability, and adhesion properties. This composite material approach allows the resin to accommodate thermal expansion differences between components while maintaining structural integrity and preventing peeling under harsh environmental conditions.
2Object-affected harmful factors
If resin is used to cover the optical element, then the optical element is protected, but thermal deterioration occurs affecting device characteristics
Solution Approach 1:
The patent changes the thermal parameters of the resin material by selecting silicone resin with superior temperature resistance. This material maintains its protective function across extreme temperature ranges without undergoing thermal deterioration, thereby protecting the optical element while withstanding high temperature environments.
3Device complexity
If resin is used to enclose the components, then the structure is complete, but peeling occurs reducing device lifespan
Solution Approach 1:
The patent uses silicone resin as a composite material that inherently resists peeling due to its elastic properties and strong adhesion. This material maintains the structural completeness of the enclosure while preventing the peeling phenomenon that would otherwise reduce device lifespan in harsh environments.
Solution Approach 2:
The silicone resin material provides beforehand cushioning against thermal stress and mechanical stress that would cause peeling. By selecting a material with appropriate elasticity and adhesion properties, the patent preemptively prevents peeling before it occurs, thereby extending device lifespan.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The use of silicone resin ensures high reliability and stability in high temperature and high humidity conditions, with reduced peeling and deterioration, maintaining consistent optical characteristics and extending the device's lifespan.
Implementation Method 1
lower expansion coefficients
Implementation Method 2
elastic modulus variation
Data Source
AI summary
An optical coupling device includes a first lead frame, a second lead frame, a first mounting member, a second mounting member, the members respectively provided on the first lead frame and, the second lead frame a light emitter provided on the first mounting member, a light receiver provided on the second mounting member, a first wire and a second wire electrically connecting the light emitter to the first lead frame, and the light receiver to the second lead frame, and an outer resin enclosure enclosing a part of the first lead frame and the second lead frame, the light emitter, and the light receiver, wherein at least the light emitter and the light receiver in the outer resin enclosure are covered with a silicone resin cured material.


