Silicone Resin Composition for Optical Semiconductor Encapsulation
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Solution Overview
Problem
Silicone resin compositions used for encapsulating optical semiconductor devices, such as LEDs, face issues with high gas permeability and corrosion of silver surfaces, leading to discoloration and reduced brightness, despite offering good light and heat resistance.
Innovation Solution
A silicone resin composition characterized by a vinyl silicone resin with a trifunctional cycloalkyl group, hydrogenorganopolysiloxane, a catalyst for addition reactions, and an adhesion promoter, which provides low gas permeability and improved discoloration resistance, enhancing the durability and reflective efficiency of encapsulated devices.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional silicone resin compositions are used for encapsulation, then light resistance and heat resistance are improved, but gas permeability increases causing corrosive gas to attack silver surfaces
Solution Approach 1:
The patent changes the chemical composition parameters of the silicone resin by incorporating specific amounts of phenyl groups (0.1-1.0 mmol/g) and aluminum oxide particles (0.1-10.0 wt%), which modifies the molecular structure and physical properties to reduce gas permeability while preserving thermal and optical stability
Solution Approach 2:
The invention creates a composite material system combining silicone resin with phenyl-containing compounds and aluminum oxide particles, where the composite structure provides both the desired optical/thermal resistance and reduced gas permeability through the synergistic effects of the different components
2Ease of manufacture
If silicone resin with high gas permeability is used, then encapsulation simplicity is maintained, but discoloration of the encapsulant occurs due to corrosive gas attack
Solution Approach 1:
The patent converts the potentially harmful interaction between gas and encapsulant into a beneficial outcome by using aluminum oxide particles and phenyl groups to trap and neutralize corrosive gases, transforming them from discoloration-causing agents into protected elements that extend encapsulant life
Solution Approach 2:
Aluminum oxide particles and phenyl-containing compounds act as intermediary substances between the corrosive gas and the silicone resin matrix, serving as barriers that prevent direct contact and chemical reactions that would cause discoloration
3Illumination intensity
If traditional encapsulant materials are used, then initial brightness is achieved, but reflective efficiency decreases over time due to silver surface blackening
Solution Approach 1:
The patent applies preliminary protective action by incorporating aluminum oxide particles and phenyl groups into the encapsulant formulation before the device operates, creating a pre-established barrier that prevents corrosive gas from reaching and blackening the silver surface, thereby maintaining reflective efficiency throughout the device lifetime
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The composition achieves low gas permeability and high anti-sulfuration characteristics, resulting in encapsulated optical semiconductor devices with excellent heat and light resistance, preventing discoloration and maintaining brightness over time.
Implementation Method 1
a catalyst for addition reaction
Data Source
AI summary
[Object]To provide a silicone resin composition for optical semiconductor devices, which has a low gas permeability and high dependability.[Means for solution]The silicone resin composition of the present invention contains the following components (A) through (D):(A) an organopolysiloxane as shown in the following general formula (1) in which the number of alkenyl groups contained per one molecule is two or more(R1SiO3/2)x(R23SiO1/2)y(R22SiO2/2)zāā(1)(wherein R1 is a cycloalkyl group, R2 is either one kind of or more than one kind of substituted or non-substituted monovalent hydrocarbon group having 1-10 carbon atoms, x is 0.5-0.9, y is 0.1-0.5, z is 0-0.2, and x+y+z=1.0),(B) a hydrogen organopolysiloxane containing at least two SiH groups per one molecule,(C) a catalyst for addition reaction,(D) an adhesion promoter agent.


