Silicone Resin Package with Conductive Structures for MEMS
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Solution Overview
Problem
Conventional packaging methods for micro-electromechanical systems, such as glass film bonding, are costly and prone to deformation under mechanical or thermal stress, limiting the miniaturization, cost-effectiveness, and reliability of inertial sensing devices.
Innovation Solution
A systematic packaging method involving a conductive structure formed on a package, such as a glass substrate or macromolecule material, using physically or chemically deposited metal or alloy materials to create patterned electrodes, capacitors, inductors, and resistors, allowing for adjustable design and electrical connectivity to prevent deformation and enhance sensing capabilities.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If glass film bonding is used for packaging, then protection of the die is improved, but deformation from mechanical or thermal stress occurs impacting performance
Solution Approach 1:
The patent changes the material parameter from glass film to silicone resin, which has different mechanical and thermal properties. The silicone resin package body is designed with specific elastic modulus and thermal expansion characteristics that reduce stress-induced deformation while maintaining protective function.
Solution Approach 2:
The patent employs composite material structure by combining silicone resin with conductive materials (silver paste, aluminum, copper) and dielectric materials. This composite approach allows the package to simultaneously achieve protection, electrical conductivity, and stress resistance.
2Reliability
If conventional molding material is used for isolation, then isolation function is provided, but cost increases and functionality is reduced
Solution Approach 1:
The silicone resin package body serves multiple functions simultaneously: it provides mechanical protection, thermal isolation, electrical insulation, and stress resistance. The conductive structures integrated into the package body eliminate the need for separate molding materials, achieving multi-functionality with a single material system.
Solution Approach 2:
The patent merges the package body and isolation structures into a single integrated design. The silicone resin package body itself provides the isolation function, while conductive structures are directly formed on its surface, eliminating the need for separate molding material layers and reducing overall complexity.
3Reliability
If glass film is used for packaging, then protection is provided, but design flexibility is reduced due to deformation issues
Solution Approach 1:
The patent introduces adjustable design parameters including variable conductive structure patterns, adjustable plating depths, and configurable electrode arrangements. These dynamic design options allow the package to be adapted for different sensing requirements while the silicone resin material provides the mechanical flexibility to accommodate these variations without deformation.
Solution Approach 2:
The conductive structures are selectively formed in specific regions of the package body surface, creating local functional zones for different sensing elements. The package body can be patterned with conductive materials in varying densities and configurations to match specific sensor design requirements, providing localized functionality.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method increases design flexibility and reduces manufacturing costs, enabling multi-degree-of-freedom inertial sensing with resistance to mechanical and thermal stress, suitable for various electronic systems, including accelerometers and gyroscopes, while integrating processing circuits for system-on-a-chip applications.
Implementation Method 1
The spreading and plating steps are performed by the methods selected from the group consisting of physically, chemistry deposit and selectively etching
Implementation Method 2
The spreading and plating steps are performed by the methods selected from the group consisting of physically, chemistry deposit and selectively etching
Implementation Method 3
A high dielectric material is buried inside the package to form a capacitor
Implementation Method 4
the spiral conductor according to a mutual inductance principle to form an inductor
Data Source
AI summary
A systematic packaging method, comprises providing a package, said package operable for packaging an object; and spreading and plating one or more conductive structures on said package; wherein said spreading and plating steps are performed by the methods selected from the group consisting of physically, chemistry deposit and selectively etching.