Curable Silicone Resin Composition for Photosemiconductor Sealing
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Solution Overview
Problem
Silicone resin compositions with dispersed metal oxide particles face challenges in maintaining transparency and mechanical characteristics due to increased viscosity, leading to handling issues and air bubble formation during curing, especially when trying to incorporate a higher number of particles for improved functionality.
Innovation Solution
Incorporating surface-modified metal oxide particles with a specific primary particle diameter range and a low-viscosity silicone compound with reactive functional groups into a curable silicone resin composition, which includes alkenyl group-containing organopolysiloxane and organohydrogenpolysiloxane, along with a hydrosilylation catalyst, to enhance dispersion and prevent air bubble formation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If a larger number of metal oxide particles are dispersed and conjugated in silicone resin material to improve functions, then the functionality is improved, but the viscosity increases due to interaction among particles having a large specific surface area, creating handling problems
Solution Approach 1:
The patent applies parameter changes by controlling the average primary particle diameter of metal oxide particles within a specific range (3 nm to 10 nm) and adjusting the viscosity of the silicone resin material to be 0.02 Pa·s or more and 100 Pa·s or less. These parameter optimizations enable the resin composition to maintain both improved functionality from particle dispersion and acceptable handling properties despite the increased particle concentration.
2Ease of operation
If silicone resin material having a low viscosity is added to decrease the viscosity of the composite composition, then the handling property is improved, but the silicone resin material easily volatilizes during heating and curing, causing air bubbles to be generated
Solution Approach 1:
The patent optimizes the viscosity parameter of the silicone resin material to be within the range of 0.02 Pa·s to 100 Pa·s, avoiding both excessively low viscosity materials that would volatilize and cause air bubbles, and excessively high viscosity materials that would impair handling. This controlled viscosity range ensures proper handling while preventing volatilization issues during curing.
3Illumination intensity
If metal oxide particles with small average primary particle diameter are used to maintain transparency, then the transparency is maintained, but the specific surface area increases leading to increased viscosity and particle interaction
Solution Approach 1:
The patent precisely controls the particle size parameter within the narrow range of 3 nm to 10 nm average primary particle diameter. This optimization maintains transparency by keeping particles sufficiently small to avoid light scattering, while simultaneously limiting the excessive specific surface area that would cause severe viscosity increases and particle interaction.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution results in a silicone resin composite with improved transparency, mechanical characteristics, and handling properties, preventing air bubble generation and maintaining a suitable viscosity for use as sealing materials in photosemiconductor devices.
Implementation Method 1
surface-modified metal oxide particles which are surface-modified by a surface-modifying material having a reactive functional group
Implementation Method 2
a curable silicone resin-forming component comprising (a) an alkenyl group-containing organopolysiloxane, (b) an organohydrogenpolysiloxane, and (c) a hydrosilylation catalyst
Data Source
AI summary
A curable silicone resin composition is provided, including (A) a curable silicone resin-forming component of which a viscosity is 0.02 Pa·s or greater and 100 Pa·s or less, (B) surface-modified metal oxide particles which are surface-modified by a surface-modifying material having a reactive functional group and have an average primary particle diameter of 3 nm or more and 10 nm or less, and (C) a silicone compound having a reactive functional group of which a viscosity is less than the viscosity of the (A) component and is 0.01 Pa·s or greater and 1.0 Pa·s or less and having a content of 0.1% by mass or more and 15% by mass or less based on a total amount of the composition, in which a viscosity is 1.0 Pa·s or greater and 100 Pa·s or less.