Silicone Resin Transparent Substrate for Flexible Displays
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing transparent substrates, such as glass, lack flexibility, high transparency, and low moisture permeability, making them unsuitable for modern applications like flexible displays and wearable terminals, while silicone resin-based alternatives face challenges in achieving optimal heat resistance, weatherability, and productivity.
Innovation Solution
A silicone resin transparent substrate with a prepreg containing a silicone resin composition comprising organopolysiloxane, organohydrogenpolysiloxane, and a platinum group metal catalyst, applied with a high attached amount of 60% to 99% to a fibrous base, achieving high transparency and low moisture permeability through press molding with a metal frame.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If glass is used as transparent substrate, then heat resistance and dimensional stability are improved, but flexibility and weight are worsened
Solution Approach 1:
The patent changes the material parameters by using silicone resin instead of glass, achieving a balance between heat resistance and flexibility. The silicone resin composition is formulated with specific molecular weight and viscosity parameters to maintain dimensional stability while enabling flexibility for wearable applications.
Solution Approach 2:
The patent creates a composite structure by combining silicone resin with inorganic fillers and reinforcing fibers. This composite approach allows the substrate to achieve both the heat resistance of inorganic materials and the flexibility of organic polymers, resolving the contradiction between these properties.
2Ease of operation
If thin film-shaped resin substrate is used, then flexibility and weight are improved, but heat resistance and dimensional stability are worsened
Solution Approach 1:
The patent employs composite materials by incorporating inorganic fillers (such as silica particles) and reinforcing fibers into the silicone resin matrix. This composite structure provides thermal stability and dimensional control while maintaining the flexibility and thin profile of the film-shaped substrate.
Solution Approach 2:
The patent applies local quality enhancement by strategically distributing reinforcing fibers and fillers within the resin matrix. The fiber orientation and filler distribution are optimized to provide dimensional stability in critical areas while preserving overall flexibility and bendability of the thin film structure.
3Temperature
If condensation type silicone resin is used, then heat resistance is improved, but moisture permeability and flexibility are worsened
Solution Approach 1:
The patent changes the chemical composition parameters by using addition-cure silicone resin instead of condensation-cure resin. This fundamental parameter change eliminates the moisture release issue while maintaining heat resistance. The vinyl-group-containing polysiloxane and hydroxyl-group-containing polysiloxane system provides thermal stability without the byproducts that increase moisture permeability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution provides a substrate with excellent heat resistance, weatherability, flexibility, and high transparency, suitable for flexible and reliable applications, while maintaining low moisture permeability and productivity.
Implementation Method 1
the silicone resin composition contains: (A) an organopolysiloxane shown by the following average composition formula (1) having two or more silicon atom-bonded alkenyl groups in one molecule
Implementation Method 2
press molding to integrate a prepreg containing a silicone resin composition containing no filler and a fibrous base
Data Source
Figure 1~2
Figure 3~5
AI summary
The present invention provides a silicone resin transparent substrate, including one or more than one prepreg containing a silicone resin composition and a fibrous base, wherein the silicone resin transparent substrate has: an attached amount of the silicone resin composition to the fibrous base of 60% by mass or more and 99% by mass or less; a total light transmittance of 80% or more at 450 nm, as measured by a method disclosed in JIS K 7375:2008 in a thickness of 0.1 mm to 0.4 mm; and a water vapor permeability of 65 g/m2•day or less, as measured by Lyssy method in conformity with JIS K 7129:2008 in a thickness of 0.1 mm to 0.4 mm; together with a method for manufacturing the same. The silicone resin transparent substrate has excellent heat resistance and weatherability, together with flexibility, high transparency, and lower moisture permeability.