Silicone Polymer Resist for Delamination Prevention

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Solution Overview

Problem

Current chemically amplified negative resist compositions face challenges in forming uniform layers on substrates with uneven surfaces, leading to delamination issues and poor pattern resolution due to insufficient adhesiveness and high viscosity, which affects the formation of fine patterns with high aspect ratios and concavity/convexity structures required in advanced semiconductor technologies.

Innovation Solution

A silicone skeleton-containing polymer compound is developed, which serves as a base resin for a chemically amplified negative resist composition, enhancing adhesiveness and crosslinking reactivity to prevent delamination and improve pattern resolution, allowing for the formation of fine patterns on substrates with complex geometries using a spin coating method.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Volume of moving object

If the film thickness exceeds about 30 μm, then the photo-curable resin composition can provide sufficient coverage, but the viscosity becomes too high to form a film on a substrate by the spin coating method

Engineering Contradiction:
Improvefilm thicknessVSAvoidviscosity
Core Design Contradiction:
Volume of moving objectVSEase of manufacture

Solution Approach 1:

The patent changes the chemical composition parameters of the resin system by incorporating silicone skeleton-containing polymer compounds with specific molecular structures and functionalities, which modify the viscosity-thickness relationship to enable coating of thicker films at manageable viscosity levels

Inventive Principle:
Principle #35Parameter changes

Solution Approach 2:

The patent uses composite resin compositions combining multiple polymer components including silicone skeleton-containing polymers, epoxy resins, and crosslinking agents to achieve a balanced formulation that provides both low enough viscosity for spin coating and sufficient thickness for adequate coverage

Inventive Principle:
Principle #40Composite materials

2Ease of manufacture

If the photo-curable resin composition is applied onto a substrate having an uneven surface by spin coating, then a film can be formed, but it is difficult to form a uniform layer and voids generate on the uneven part

Engineering Contradiction:
Improvefilm formationVSAvoiduniformity
Core Design Contradiction:
Ease of manufactureVSManufacturing precision

Solution Approach 1:

The patent modifies the rheological parameters of the resin composition by adjusting viscosity and adding flow control agents, enabling the material to flow into and fill uneven substrate surfaces during spin coating, then stabilize to form uniform layers without voids

Inventive Principle:
Principle #35Parameter changes

Solution Approach 2:

The silicone skeleton-containing polymer acts as an intermediary substance that mediates between the coating process and the uneven substrate surface, providing both flowability to conform to surface variations and structural integrity to maintain uniformity after deposition

Inventive Principle:
Principle #24Intermediary (Mediator)

3Manufacturing precision

If a chemically amplified negative resist composition is used to obtain fine patterns, then pattern resolution improves, but adhesiveness between the resist composition and substrates is not sufficient, causing delamination

Engineering Contradiction:
Improvepattern resolutionVSAvoidadhesiveness
Core Design Contradiction:
Manufacturing precisionVSStrength

Solution Approach 1:

The patent creates a composite resist composition that integrates silicone skeleton-containing polymers with traditional chemically amplified negative resist components, combining the fine pattern formation capability of chemically amplified resins with the superior adhesion properties of silicone-based materials

Inventive Principle:
Principle #40Composite materials

Solution Approach 2:

The patent introduces specific functional groups and molecular structures in the silicone skeleton-containing polymer that provide localized adhesion enhancement at the substrate-resist interface while maintaining the overall chemically amplified negative resist characteristics for fine pattern resolution

Inventive Principle:
Principle #3Local quality

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The silicone skeleton-containing polymer compound improves adhesiveness and crosslinking reactivity, enabling the formation of fine patterns with high aspect ratios and concavity/convexity structures without scum or footing profiles, and provides excellent flexibility, heat resistance, and chemical resistance when post-cured, suitable for advanced semiconductor applications.

Implementation Method 1

enhancing adhesiveness and crosslinking reactivity to prevent delamination

Methodology Applied
Scientific EffectCrosslinking: Chemical Bonding

Implementation Method 2

chemically amplified negative resist composition

Methodology Applied
Scientific EffectPhotopolymerization: Photopolymerisation

Data Source

PatentUS10087288B2Silicone skeleton-containing polymer compound, chemically amplified negative resist composition, photo-curable dry film and method for producing same, patterning process, layered product, substrate, and semiconductor apparatus
Publication Date: 2018.10.02 SHIN ETSU CHEMICAL CO LTD
  • US10087288B2 patent drawing
  • US10087288B2 patent drawing
  • US10087288B2 patent drawing

AI summary

The present invention provides a silicone skeleton-containing polymer compound containing a repeating unit shown by the general formula (1). There can be provided a silicone skeleton-containing polymer compound suitable used as a base resin of a chemically amplified negative resist composition that can remedy the problem of delamination generated on a metal wiring such as Cu and Al, an electrode, and a substrate, especially on a substrate such as SiN, and can form a fine pattern without generating a scum and a footing profile in the pattern bottom and on the substrate.