Silicone Polymer Resist Composition Adhesion

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Solution Overview

Problem

Chemically amplified negative resist compositions face challenges with poor adhesion to substrates, leading to stripping issues on metal wirings and SiN substrates, and have low dissolution contrast, resulting in inadequate pattern formation and potential damage to electronic circuits during redistribution.

Innovation Solution

A chemically amplified negative resist composition incorporating a silicone structure-bearing polymer, a photoacid generator, a crosslinker, and a solvent, which improves adhesion and dissolution contrast by using a bis(4-hydroxy-3-allylphenyl) derivative, enabling better pattern formation and substrate interaction.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Manufacturing precision

If conventional negative resist composition is used, then pattern formation is achieved, but adhesion to substrate deteriorates causing stripping

Engineering Contradiction:

Improvepattern formationVSAvoidadhesion to substrate

Core Design Contradiction:

Manufacturing precisionVSReliability

Solution Approach 1:

The patent uses a composite material system consisting of a silicone structure-bearing polymer combined with a phenolic resin. The silicone polymer provides adhesion to the substrate while the phenolic resin contributes to pattern formation and structural integrity. This composite approach resolves the contradiction by combining materials with complementary properties to achieve both good adhesion and reliable pattern formation.

Inventive Principle:

Principle #40Composite materials

Solution Approach 2:

The patent modifies the chemical composition parameters of the resist system by introducing a specific silicone structure-bearing polymer with controlled molecular weight and structure. This parameter change in the material composition enables simultaneous improvement of adhesion properties and pattern formation capability, resolving the contradiction between these two requirements.

Inventive Principle:

Principle #35Parameter changes

2Ease of manufacture

If conventional negative resist composition is used, then coating is applied, but dissolution contrast deteriorates resulting in inadequate pattern formation

Engineering Contradiction:

Improvecoating applicationVSAvoidpattern formation

Core Design Contradiction:

Ease of manufactureVSManufacturing precision

Solution Approach 1:

The composite system of silicone polymer and phenolic resin provides different dissolution rates during development. The phenolic resin portion dissolves at a different rate than the silicone polymer, creating high dissolution contrast that enables precise pattern formation while maintaining ease of coating application.

Inventive Principle:

Principle #40Composite materials

Solution Approach 2:

The resist composition exhibits local quality differences in its components - the phenolic resin provides regions with specific dissolution characteristics while the silicone polymer provides regions with different dissolution characteristics. This local differentiation in dissolution behavior enables high contrast pattern formation during development.

Inventive Principle:

Principle #3Local quality

3Productivity

If pattern is formed on metal wirings or SiN substrates, then redistribution is achieved, but stripping occurs causing damage to electronic circuits

Engineering Contradiction:

ImproveredistributionVSAvoidstripping damage

Core Design Contradiction:

ProductivityVSObject-affected harmful factors

Solution Approach 1:

The silicone structure-bearing polymer is applied beforehand to create an adherent protective layer between the substrate/metal wirings and the pattern structure. This pre-applied layer acts as a cushioning interface that prevents stripping damage during subsequent processing steps, enabling safe redistribution operations.

Inventive Principle:

Principle #11Beforehand cushioning (Prior cushioning)

Solution Approach 2:

The silicone polymer serves as an intermediary layer between the substrate and the patterned resist structure. This intermediate layer provides adhesion and mechanical coupling, preventing direct stripping of the pattern from the substrate and enabling damage-free redistribution processes.

Inventive Principle:

Principle #24Intermediary (Mediator)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The composition significantly enhances adhesion to substrates, reduces stripping, and improves pattern resolution, preventing damage to electronic circuits and enabling the formation of reliable protective films for electronic parts.

Implementation Method 1

a photoacid generator which is decomposed to generate an acid upon exposure to radiation of wavelength 190 to 500 nm

Methodology Applied

Scientific EffectPhotoacid generation: Photodissociation

Implementation Method 2

at least one crosslinker selected from the group consisting of an amino condensate modified with formaldehyde or formaldehyde-alcohol, a phenol compound having on the average at least two methylol or alkoxymethylol groups in the molecule

Methodology Applied

Scientific EffectCrosslinking: Chemical Bonding

Data Source

PatentEP2980172B1Silicone structure-bearing polymer, negative resist composition, photo-curable dry film, patterning process, and electric/electronic part-protecting film

Publication Date: 2016.11.02 SHIN ETSU CHEMICAL CO LTD

Figure 1

AI summary

A silicone structure-bearing polymer comprising recurring units derived from a bis(4-hydroxy-3-allylphenyl) derivative and having a Mw of 3,000-500,000 is provided. A chemically amplified negative resist composition comprising the polymer overcomes the stripping problem that a coating is stripped from metal wirings of Cu or Al, electrodes, and SiN substrates.