Thermally Conductive Silicone Rubber Composition Handleability
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Solution Overview
Problem
Thermally conductive silicone rubber compositions with high thermal conductivity become excessively viscous and difficult to handle when a large amount of thermally conductive filler is incorporated, leading to impaired handleability and physical properties, while the addition of reinforcing fillers compromises thermal conductivity.
Innovation Solution
A thermally conductive silicone rubber composition comprising an organopolysiloxane, a thermally conductive filler, a specific organopolysiloxane structure, and a silane compound, which allows for high thermal conductivity and improved adhesion and elongation characteristics without the need for reinforcing fillers, achieved through a hydrosilylation reaction or other curing mechanisms.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a large amount of thermally conductive filler is incorporated to improve thermal conductivity, then thermal conductivity is improved, but handleability and moldability deteriorate due to excessive viscosity
Solution Approach 1:
The patent changes the chemical composition parameters by introducing specific organopolysiloxanes with vinyl groups and organohydrogenpolysiloxanes with silicon-bonded hydrogen atoms, along with specific adhesion-imparting agents and catalysts, to modify the rheological properties and enable better handling despite high filler content
Solution Approach 2:
The patent uses adhesion-imparting agents (such as epoxy silane or alkyltitanate) and platinum-type catalysts as intermediary substances that facilitate the curing reaction and improve the overall performance of the composition, allowing high filler content to be managed effectively
2Temperature
If a large amount of thermally conductive filler is incorporated to improve thermal conductivity, then thermal conductivity is improved, but physical properties deteriorate
Solution Approach 1:
The patent creates a composite material system combining organopolysiloxane, organohydrogenpolysiloxane, thermally conductive filler, adhesion-imparting agent, and catalyst, where the synergistic interaction of components maintains physical properties despite high filler content
Solution Approach 2:
The patent optimizes the ratio and chemical characteristics of the polysiloxane components and catalyst to ensure that the cured product maintains appropriate physical properties while incorporating high levels of thermally conductive filler
3Strength
If reinforcing filler is added to improve adhesion and elongation, then adhesion and elongation are improved, but thermal conductivity deteriorates
Solution Approach 1:
The patent extracts the reinforcing function from traditional reinforcing fillers and achieves it through the optimized base polymer composition and adhesion-imparting agents, thereby eliminating the need for separate reinforcing fillers that would compromise thermal conductivity
Solution Approach 2:
The patent makes the base polymer composition multi-functional by incorporating adhesion-imparting agents and catalysts that simultaneously provide adhesion, elongation, and thermal conductivity without requiring separate reinforcing fillers
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The composition demonstrates good handleability and thixotropic properties with high tensile strength and adhesion, even with a large amount of thermally conductive filler, making it suitable for applications in electronic devices and stencil printing.
Implementation Method 1
achieved through a hydrosilylation reaction or other curing mechanisms
Implementation Method 2
a thermally conductive silicone rubber composition that demonstrates good handleability and possesses appropriate thixotropicity in spite of having a large content of thermally conductive filler
Implementation Method 3
demonstrates good handleability and possesses appropriate thixotropicity
Data Source
AI summary
A thermally conductive silicone rubber composition comprising: (A) an organopolysiloxane with the exception of below-given components (C) and (E); (B) a thermally conductive filler; (C) a specific organopolysiloxane; (D) a curing agent; (E) a resin-like organopolysiloxane; and (F) a silane compound showing no affinity to aforementioned component (A), wherein component (E) is contained in an amount of 2 to 10 mass % per sum of components (A) and (E), and wherein said component (F) is contained in an amount sufficient for coating 1 to 70% of the entire surface of component (B) determined from the contents of component (B) and the BET specific surface area of aforementioned component (B), demonstrates good handleability and possesses appropriate thixotropicity even when it contains a large amount of thermally conductive filler and when cured is capable of forming a thermally conductive silicone rubber characterized by good adhesive properties and elongation characteristics even without the use of a reinforcing filler.