Silicone Sealing Frame Adhesion and Moisture Barrier
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Solution Overview
Problem
Existing package structures using silicone frames as sealing frames face issues with adhesion to substrates, particularly with materials of different properties like metal, glass, or polymer, leading to poor moisture barrier performance and susceptibility to corrosion from polar solvents and plasticizers, due to low polarity and gas generation during curing which forms bubbles and reduces adhesion.
Innovation Solution
A package structure employing two silicone frames with highly cross-linking bonds and crystalline interfaces, where the first silicone frames are modified to enhance adhesion through increased addition-type silicone content and interfacial tension, and a second silicone frame is used to form strong crystalline bonds with the first frames, along with an auxiliary sealing frame to further reduce moisture penetration.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If silicone material is used as sealing frame, then corrosion resistance and moisture barrier performance are improved, but adhesion to substrates deteriorates due to low polarity and gas generation during curing
Solution Approach 1:
The patent applies composite materials by combining silicone material with other materials to form a multi-layer sealing frame structure. The first sealing frame layer uses silicone material for corrosion resistance and moisture barrier, while the second sealing frame layer uses different material for adhesion to substrates. This composite approach allows each layer to perform its specialized function, resolving the contradiction between moisture barrier performance and adhesion strength.
2Strength
If condensation reaction is used for silicone curing, then adhesion ability improves, but gas generation increases forming bubbles that reduce adhesion
Solution Approach 1:
The patent segments the curing process and silicone material into two distinct parts: a first sealing frame layer that undergoes condensation reaction for adhesion, and a second sealing frame layer that undergoes addition reaction without gas generation. This segmentation allows the adhesion function and the gas-free curing function to be separated into different layers, resolving the contradiction between adhesion ability and gas generation.
Solution Approach 2:
The patent changes the chemical reaction parameters by selecting different curing mechanisms for different layers. The first layer uses condensation reaction parameters for adhesion, while the second layer uses addition reaction parameters that eliminate gas generation. This parameter change approach allows optimization of each layer's properties independently.
3Strength
If high polarity materials are used for sealing frame, then adhesion to substrates improves, but penetration by organic solvent and plasticizer increases reducing sealing ability
Solution Approach 1:
The patent uses composite materials with two distinct layers: the first layer uses high polarity silicone material for adhesion to substrates, while the second layer uses low polarity material for solvent and plasticizer resistance. This composite structure allows each layer to perform its specialized function, resolving the contradiction between adhesion strength and sealing ability against chemical penetration.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution provides an effective moisture barrier with enhanced adhesion and resistance to corrosion, preventing gas accumulation and improving the structural integrity of the silicone frame, while maintaining electrical isolation and heat resistance.
Implementation Method 1
the silicone material will perform both the condensation reaction and the addition reaction during curing
Implementation Method 2
the silicone material will perform both the condensation reaction and the addition reaction during curing
Implementation Method 3
a second silicone frame is used to form strong crystalline bonds with the first frames
Data Source
AI summary
A package structure of electronic modules includes two substrates and a sealing frame. The sealing frame comprises two first silicone frames, a second silicone frame and two crystalline interfaces. The sealing frame is disposed between and within the two substrates to form a space thereof. The sealing frame serves as an excellent moisture barrier of the package structure due to the intrinsic properties of silicone. Meanwhile, the silicone can withstand the corrosion of the polar solvents and/or the plasticizers. A manufacturing method of the package structure is disclosed in this invention as well.


