Silicone Laminated Substrate Composition for Flexible LED Mounting
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional silicone laminated substrates used for LED devices and electronic components face challenges such as complex production methods, weak adhesive strength, and insufficient mechanical properties, including crack resistance and heat resistance, which limit their application and reliability.
Innovation Solution
A silicone laminated substrate comprising a glass cloth coated with a cured silicone resin composition containing organopolysiloxane, organohydrogenpolysiloxane, a platinum group metal-based catalyst, and a filler, which is impregnated into the glass cloth and cured under compression molding conditions, providing enhanced mechanical properties and minimal surface tack.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional condensation-curable varnish or addition-curable varnish is used to produce silicone laminated substrates, then the substrates exhibit good weather resistance and heat resistance, but the production method becomes complex and the adhesive strength becomes too weak to bond copper foil to the substrate surface
Solution Approach 1:
The patent modifies the chemical composition parameters of the silicone resin by incorporating specific ratios of vinyl-containing organopolysiloxane (5-50 mol%) and hydrosilyl-containing organopolysiloxane (45-95 mol%), along with controlled amounts of crosslinking catalyst and curing agent. This parameter optimization enables the resin to achieve both strong adhesion to copper foil and simplified processing without requiring complex production methods
Solution Approach 2:
The invention creates a composite silicone resin system by combining multiple components: vinyl-containing organopolysiloxane, hydrosilyl-containing organopolysiloxane, crosslinking catalyst, curing agent, and optional fillers. This composite material approach achieves synergistic effects that simultaneously improve adhesive strength and simplify the production process while maintaining weather and heat resistance
2Temperature
If ceramics such as alumina and aluminum nitride are used for LED mounting substrates to achieve superior heat resistance, then heat resistance is improved, but the substrates become expensive and difficult to fabricate in large scale
Solution Approach 1:
The patent replaces expensive ceramic materials with a cost-effective silicone resin-based laminated substrate that can be manufactured using conventional lamination processes. The silicone resin composition is designed to achieve ceramic-like heat resistance properties at a fraction of the cost, making large-scale fabrication economically viable and technically feasible
Solution Approach 2:
The invention adjusts the silicone resin composition parameters including the molecular weight, vinyl group content, and crosslinking density to achieve a glass transition temperature and thermal stability comparable to ceramics. The resin formulation (components A-B-D in specific ratios) enables the substrate to withstand LED operating temperatures while maintaining flexibility in manufacturing
3Strength
If B-staged addition-curable silicone varnish is used and precuring is performed during manufacturing, then the laminated substrate can be produced, but satisfactory levels of strength and workability are not always obtainable and the production steps remain complex
Solution Approach 1:
The patent incorporates all necessary components (vinyl-containing organopolysiloxane, hydrosilyl-containing organopolysiloxane, crosslinking catalyst, and curing agent) in the correct ratios during the resin formulation stage, eliminating the need for separate precuring steps. The resin is designed to cure completely during the final lamination process, achieving both high strength and good workability in a single operation
Solution Approach 2:
The invention merges the precuring and final curing operations into a single lamination step by formulating the silicone resin with all required components pre-mixed in optimal proportions. This consolidation simplifies the production process while ensuring uniform curing and satisfactory mechanical strength and workability properties
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution results in a substrate with improved mechanical properties, flexibility, and ease of handling, suitable for LED devices and electronic components, with excellent heat resistance and discoloration resistance, and minimal surface tack, enabling reliable performance and long lifespan.
Implementation Method 1
the silicone resin composition comprises: (A) an organopolysiloxane having a resin structure... (B) an organohydrogenpolysiloxane having a resin structure... (C) a platinum group metal-based catalyst
Implementation Method 2
the silicone resin composition comprises: (C) a platinum group metal-based catalyst
Implementation Method 3
wherein the silicone resin composition is dissolved or dispersed in a solvent, subsequently removing the solvent from the glass cloth by evaporation
Implementation Method 4
subsequently subjecting the silicone resin composition impregnated into the glass cloth to heat curing under compression molding conditions
Data Source
Figure 1
AI summary
A silicone laminated substrate, including a glass cloth, and a cured product of a silicone resin composition with which the glass cloth is filled and a surface of the glass cloth is coated, in which the silicone resin composition includes: (A) an organopolysiloxane having a resin structure consisting of specific siloxane units, (B) an organohydrogenpolysiloxane having a resin structure consisting of specific siloxane units, (C) a platinum group metal-based catalyst, and (D) a filler. The silicone laminated substrate exhibits excellent mechanical properties, flexibility and workability, has minimal surface tack, and is easy to handle. The silicone laminated substrate is produced by impregnating a glass cloth with the silicone resin composition that is dissolved or dispersed in a solvent, subsequently removing the solvent from the glass cloth by evaporation, and subjecting the composition impregnated into the glass cloth to heat curing under compression molding conditions. From the silicone laminated substrate that is used for an LED device, an LED device can be obtained that includes the substrate and an LED chip mounted on top of the substrate.