Silicone Laminated Substrate Composition for Low-Warp LED Boards
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Solution Overview
Problem
Conventional epoxy resin substrates used in LED devices suffer from heat resistance and weatherability issues due to thermal expansion, leading to warp and deformation, especially with the increasing calorific value and luminance of LED devices, and silicone resin substrates with lower glass transition temperatures exacerbate these problems.
Innovation Solution
A silicone resin composition with a 3-dimensional network structure, comprising organopolysiloxane and organohydrogenpolysiloxane, a platinum group metal catalyst, and a filler, is impregnated into a glass cloth and cured to produce a substrate with a high glass transition temperature, low thermal expansion coefficient, and improved heat resistance and weatherability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Stability of the object's composition
If inorganic filler is added in large quantities to suppress thermal expansion coefficient, then thermal expansion coefficient is reduced, but fluidity and drilling workability are reduced
Solution Approach 1:
The invention changes the chemical composition parameters of the resin system by introducing a specific silicone resin component with controlled crosslinking density. This allows achieving low thermal expansion coefficient through compositional modification rather than relying on high filler content, thereby maintaining good fluidity and drilling workability.
Solution Approach 2:
The invention creates a composite resin system combining epoxy resin with a specific silicone resin component. This composite approach enables the resin matrix itself to exhibit low thermal expansion properties without requiring large quantities of inorganic filler, thus avoiding the negative effects on fluidity and drilling workability.
2Productivity
If substrate is thinned to achieve higher integration, then device density is improved, but warp and connection failure occur
Solution Approach 1:
The invention modifies the thermal and mechanical parameters of the substrate material by using a silicone resin system with controlled crosslinking. This enables thin substrates to maintain sufficient mechanical strength and dimensional stability, preventing warp and connection failure even at reduced thickness for high-density applications.
3Ease of manufacture
If silicone resin with lower glass transition temperature is used, then processing is easier, but warp occurs during substrate thinning
Solution Approach 1:
The invention optimizes the glass transition temperature parameter of the silicone resin through controlled crosslinking density and composition. The resulting resin achieves an optimal balance with a glass transition temperature of 150°C or higher, providing both ease of processing and sufficient dimensional stability to prevent warp during substrate thinning.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The resulting silicone laminated substrate exhibits enhanced heat resistance, suppressed warp and deformation, and improved weatherability, making it suitable for high-performance LED devices and electronic equipment.
Implementation Method 1
an organopolysiloxane with a 3-dimensional network structure composed of a T unit represented by an RSiO1.5 unit and an R1SiO1.5 unit and an R2SiO1.5 unit
Implementation Method 2
a platinum group metal catalyst
Implementation Method 3
the silicone resin composition for producing a silicone laminated substrate by being impregnated in a glass cloth
Data Source
AI summary
The invention provides a silicone resin composition for producing a silicone laminated substrate by being impregnated in a glass cloth and cured therein, comprising: (A) an organopolysiloxane with a 3-dimensional network structure composed of an R1SiO1.5 unit and an R2SiO1.5 unit and a T unit represented by an RSiO1.5 unit; (B) an organohydrogenpolysiloxane composed of an R1SiO1.5 unit, an R12SiO unit and an R1aHbSiO(4-a-b)/2 unit; (C) a platinum group metal catalyst; and (D) a filler. There can be a silicone resin composition having a high glass transition temperature, a silicone laminated substrate excellent in properties such as heat resistance and weatherability having low thermal expansion coefficient and suppressed warp and deformation, a method for producing the same and an LED device.