Siloxane-Aromatic Polymer Resin for Low Dielectric PCBs
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional materials for high-frequency, high-thermal-resistant printed circuit boards face challenges in maintaining low dielectric constant and dissipation factor, which affects signal transmission integrity and adhesion with copper foil, leading to reduced functionality and reliability.
Innovation Solution
A polymer composition comprising specific repeating units and an epoxy resin, with a controlled molar ratio and inclusion of inorganic powders, is developed to achieve a low dielectric constant and high thermal resistance, enhancing signal integrity and adhesion.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a sufficient quantity of filler is employed in epoxy resin system to enhance flame retardancy, then thermal resistance and flame retardancy are improved, but adhesion between epoxy resin layer and copper foil decreases
Solution Approach 1:
The patent changes the chemical composition parameters of the resin system by introducing a specific polymer with siloxane bonds and aromatic rings, replacing part of the conventional epoxy resin. This parameter change allows achieving flame retardancy through molecular structure design rather than filler addition, thus maintaining adhesion.
Solution Approach 2:
The patent creates a composite resin system combining the novel polymer (with siloxane and aromatic structures) and epoxy resin. This composite material integrates the flame-retardant properties of siloxane/aromatic structures with the good adhesion and mechanical properties of epoxy resin, resolving the contradiction between flame retardancy and adhesion.
2Reliability
If conventional epoxy resin system with filler is used to achieve flame retardancy, then thermal resistance is improved, but dielectric constant increases
Solution Approach 1:
The patent changes the resin composition parameters by incorporating a polymer with specific aromatic ring structures and siloxane bonds. These structural parameters inherently provide thermal resistance while maintaining low dielectric constant, avoiding the need for high filler content that would increase dielectric loss.
Solution Approach 2:
The patent converts the potential harm of high filler content (which increases dielectric constant) into a benefit by using molecular-level flame retardant structures (siloxane and aromatic rings) that provide thermal resistance without the adverse dielectric effects of particulate fillers.
3Weight of moving object
If high-density printed circuit board materials are used to meet size and weight requirements, then miniaturization is achieved, but signal transmission integrity deteriorates
Solution Approach 1:
The patent changes the dielectric parameters of the substrate material by using the novel polymer-epoxy resin system. This material has inherently low dielectric constant and low dissipation factor due to its molecular structure, enabling high-frequency signal transmission even in miniaturized, high-density circuit board configurations.
Data Source
AI summary
A polymer is provided. The polymer includes a first repeating unit represented by Formula (I) and a second repeating unit represented by Formula (II):wherein Y1 and Y2 are independently —H, —CH3, or —CH2CH3; n is an integer ranging from 1 to 25; and the molar ratio of the first repeating unit to the second repeating unit is from 5:95 to 15:45. A resin composition including the aforementioned polymer is also provided.