Negative Photosensitive Siloxane Composition for Crack-Resistant Thick Films
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Solution Overview
Problem
Conventional photosensitive siloxane compositions used for forming insulating films in semiconductor devices and displays are prone to cracking when thick and lack sufficient heat resistance, requiring complex lithography and etching processes.
Innovation Solution
A negative type photosensitive siloxane composition comprising specific polysiloxane repeating units, a photo base generator, and a solvent, which forms a thick and highly heat-resistant cured film when exposed to light and developed, eliminating the need for etching processes.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If conventionally proposed photosensitive siloxane compositions are used to form insulating films, then the films can be formed without lithography and etching processes, but the films are liable to suffer from cracking when thickly formed and have insufficient heat resistance
Solution Approach 1:
The patent modifies the chemical composition parameters of the photosensitive siloxane by incorporating specific repeating units with controlled ratios (Formula Ia units with R1 being alkyl or aryl groups, and Formula Ib units with R2 being hydrogen or alkyl groups). The FT-IR spectral parameters (S2/S1 ratio of 0.05 to 0.15) are precisely controlled to optimize the balance between film thickness capability, crack resistance, and heat resistance, eliminating the need for lithography and etching while producing reliable thick films.
Solution Approach 2:
The patent creates a composite photosensitive siloxane system by combining multiple repeating units (Formula Ia and Formula Ib) with different chemical structures and properties within a single polymer chain. This composite structure integrates the benefits of different siloxane units to achieve simultaneous improvement in film-forming capability, crack resistance, and heat resistance that cannot be obtained by single-structure polymers alone.
2Quantity of substance
If the insulating film is formed thickly from conventionally proposed photosensitive siloxane compositions, then the film can provide sufficient insulation, but the film is liable to suffer from cracking
Solution Approach 1:
The patent optimizes the molecular structure parameters of the polysiloxane by controlling the types and ratios of repeating units (Formula Ia and Formula Ib) and adjusting the FT-IR spectral characteristics (S2/S1 ratio). These parameter changes enable the film to maintain structural integrity at greater thicknesses, allowing thick film formation without cracking while providing sufficient insulation.
3Ease of manufacture
If conventional photosensitive siloxane compositions are used, then the production cost can be reduced by eliminating etching processes, but the heat resistance of the insulating film has room for improvement
Solution Approach 1:
The patent enhances heat resistance by modifying the chemical composition parameters of the photosensitive siloxane, specifically incorporating repeating units with thermally stable structures (Formula Ia with aryl groups and Formula Ib with controlled R2 substituents) and optimizing the FT-IR spectral characteristics. This maintains the simplified manufacturing process while achieving superior heat resistance.
Solution Approach 2:
The patent constructs a composite photosensitive siloxane material combining thermally stable repeating units that work synergistically to provide both cost-effectiveness (by eliminating etching) and enhanced heat resistance, creating a multi-functional material system.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The composition enables the easy formation of thick, heat-resistant insulating films suitable for electronic devices, reducing production costs and avoiding cracking issues, while allowing for pattern formation without complex processing steps.
Implementation Method 1
a photo base generator represented by the following formula (PBG-A) or (PBG-B)
Implementation Method 2
negative type photosensitive siloxane composition... forms a thick and highly heat-resistant cured film when exposed to light and developed
Data Source
AI summary
[Object] To provide a negative type photosensitive siloxane composition capable of forming a cured film excellent in heat resistance and critical thickness for cracking [Means] The present invention provides a negative type photosensitive siloxane composition comprising: a polysiloxane containing silanol in a specific content, a particular photo base generator, and a solvent. The content of silanol is measured by FT-IR.