Siloxane Encapsulant Composition for LED Heat Resistance
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Solution Overview
Problem
Conventional encapsulants for light emitting devices, such as LEDs and OLEDs, face challenges in reliability due to limitations in heat resistance and gas permeability, particularly in maintaining transmittance over extended heat treatment periods.
Innovation Solution
A siloxane monomer derived from specific chemical formulas, combined with polysiloxanes, is used to create an encapsulant composition that enhances cross-linking density, thereby improving heat resistance and reducing moisture and oxygen permeability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional encapsulants are used, then the device structure is simple, but heat resistance and gas permeability are insufficient leading to poor reliability
Solution Approach 1:
The patent employs composite materials by combining siloxane monomer, polysiloxane, and crosslinking agent to create an encapsulant composition that achieves superior heat resistance and gas permeability properties while maintaining structural integrity under thermal stress
Solution Approach 2:
The patent utilizes parameter changes through controlling the crosslinking density and molecular structure of the siloxane-based composition, adjusting the ratio of siloxane monomer to polysiloxane and selecting specific crosslinking agents to optimize thermal and barrier properties
2Temperature
If cross-linking density is increased to improve heat resistance, then transmittance degradation is reduced, but gas permeability may be affected
Solution Approach 1:
The patent applies local quality by creating a crosslinked network structure that provides different properties in different regions - the crosslinked regions provide heat resistance while the siloxane-based matrix maintains gas permeability control, achieving localized functional optimization
Solution Approach 2:
The patent controls the degree of crosslinking and molecular parameters to achieve the optimal balance between heat resistance and gas permeability, using specific crosslinking agents and ratios to tune the network density and pore structure
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The encapsulant composition exhibits a transmittance degradation rate of less than or equal to 10% after 1000 hours at 150°C, while simultaneously improving heat resistance and gas permeability, making it suitable for electronic devices.
Implementation Method 1
enhances cross-linking density, improving heat resistance and reducing moisture and oxygen permeability
Data Source
AI summary
A siloxane monomer obtained from a compound represented by Chemical Formula 1 and a compound represented by Chemical Formula 2, an encapsulant composition including the siloxane monomer, an encapsulant obtained by curing the encapsulant composition, and an electronic device including the encapsulant are disclosed.