Siloxane Epoxy Resin Composition for Low Dielectric Loss
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Solution Overview
Problem
Epoxy resin compositions used in electronic applications often exhibit insufficient dielectric properties, particularly high dielectric constants and loss tangents, which do not meet the requirements for advanced packaging applications.
Innovation Solution
A resin composition comprising an epoxy resin and a siloxane-type curing agent, which improves dielectric properties by forming a siloxane-type curing agent without the need for fluoride or bromide catalysts, resulting in a dielectric constant (Dk) of 3 or below and a loss tangent (Df) of 0.02 or below.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional epoxy resin compositions are used, then good adhesion and mechanical strength are achieved, but dielectric properties (dielectric constant and loss tangent) are insufficient
Solution Approach 1:
The patent changes the chemical parameters of the curing agent by using siloxane-type structures with specific molecular formulas (R1-R6 being hydrogen, alkyl, aryl, or halogen atoms). This parameter change in the curing agent composition directly improves dielectric properties while maintaining manufacturability, achieving Dk ≤ 3.0 and Df ≤ 0.020 without complex multi-step processes
Solution Approach 2:
The patent creates a composite curing system by combining siloxane-type curing agents with epoxy resins. The siloxane structure (containing Si-O-Si bonds) integrates with the epoxy matrix to form a composite material that exhibits superior dielectric properties compared to conventional epoxy formulations, resolving the contradiction between performance and manufacturing simplicity
2Reliability
If silylated novolac-type hardeners or alkoxysilylated hardeners are used, then thermal stability is improved, but dielectric properties (dielectric constant and loss tangent) remain insufficient
Solution Approach 1:
The patent applies local quality by specifically designing the siloxane-type curing agent with controlled molecular structures where R1-R6 represent specific atomic groups. This localized structural optimization in the curing agent molecule achieves the desired dielectric properties (Dk ≤ 3.0, Df ≤ 0.020) without requiring complex overall device or process designs
Solution Approach 2:
The patent changes the structural parameters of the curing agent by using siloxane-type structures with specific molecular formulas (R1-R6 being hydrogen, alkyl, aryl, or halogen atoms). This parameter change in the curing agent composition directly improves dielectric properties while maintaining manufacturability, achieving Dk ≤ 3.0 and Df ≤ 0.020 without complex multi-step processes
3Ease of manufacture
If fluoride or bromide catalysts are used for ring-opening of epoxides with aryl silyl ethers, then curing reaction is achieved, but contamination occurs making them unattractive for electronic applications
Solution Approach 1:
The patent extracts and eliminates the harmful fluoride or bromide catalysts from the curing process. By using siloxane-type curing agents that can cure epoxy resins without requiring these halide catalysts, the invention removes the source of halide contamination while maintaining effective curing, thus resolving the contradiction between ease of manufacture and harmful contamination
Solution Approach 2:
The patent converts the potential harm of requiring catalysts into a benefit by designing a curing system that achieves effective curing without halide catalysts. The siloxane-type curing agent structure itself enables the curing reaction without introducing harmful contaminants, turning the challenge of catalyst-free curing into a advantageous feature for electronic applications
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The composition achieves significantly improved dielectric properties, meeting the requirements for electronic applications by reducing dielectric constants and loss tangents, thereby enhancing the performance of insulating layers in electronic devices.
Implementation Method 1
The opening of epoxides with aryl silyl ethers is generally known. Tetr. Lett. 190, 31, 1723-1726 discloses the ring-opening of bisphenol A diglycidyl ether with aryl silyl ethers catalyzed by cesium fluoride.
Implementation Method 2
a siloxane-type curing agent of formula (C1) wherein R1 to R6 independently represent a hydrogen atom, an alkyl group, an aryl group or a halogen atom
Data Source
AI summary
A resin composition, comprising (a) at least one epoxy resin, and (b) at least one siloxane-type curing agent of formula C22 or C31 (C22) (C31) wherein the resin composition does essentially not contain any fluoride or bromide.