Light-Diffusing Organopolysiloxane Composition With Filler Balance

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Solution Overview

Problem

There is a demand for novel light-diffusing materials with excellent light transmittance, light diffusivity, and mechanical properties, particularly those that are durable in reflow type soldering processes and can enhance light extraction efficiency from light emitting devices like LEDs.

Innovation Solution

A curable organopolysiloxane composition is developed, comprising an organopolysiloxane with radical reactive groups, inorganic fillers such as spherical silica or alumina particles, and an organosilicon compound. This composition is designed to achieve a balance of optical and mechanical properties, including high light diffusivity and flexibility.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Illumination intensity

If silicone resin composition contains high content of inorganic filler for light diffusion, then light diffusivity is improved, but light transmittance and mechanical properties deteriorate

Engineering Contradiction:
Improvelight diffusivityVSAvoidmechanical properties
Core Design Contradiction:
Illumination intensityVSReliability

Solution Approach 1:

The patent applies parameter changes by carefully controlling the particle size distribution of inorganic fillers (combining fine particles of 0.1-1μm with coarse particles of 1-10μm), the ratio of organopolysiloxane components (A and B), and the crosslinking density to achieve optimal balance between light diffusion and mechanical strength

Inventive Principle:
Principle #35Parameter changes

Solution Approach 2:

The patent uses composite materials by combining different types of organopolysiloxane (component A with reactive groups and component B as base polymer), multiple sizes of inorganic fillers, and crosslinking agents to create a multi-phase system that simultaneously provides mechanical strength and light diffusion properties

Inventive Principle:
Principle #40Composite materials

2Ease of manufacture

If silicone resin composition uses conventional curing method, then ease of manufacture is improved, but durability in reflow soldering process deteriorates

Engineering Contradiction:
Improvecuring process simplicityVSAvoiddurability in reflow soldering
Core Design Contradiction:
Ease of manufactureVSReliability

Solution Approach 1:

The patent changes the chemical parameters of the curing system by using specific crosslinking agents and catalysts that enable complete crosslinking at moderate temperatures, achieving high heat resistance without requiring excessive curing conditions that would complicate manufacturing

Inventive Principle:
Principle #35Parameter changes

Solution Approach 2:

The patent employs a composite curing system combining organometallic catalysts and specific crosslinking agents that work synergistically to provide both ease of processing and high thermal stability in the final cured product

Inventive Principle:
Principle #40Composite materials

3Temperature

If organopolysiloxane contains high content of aryl groups for heat resistance, then temperature stability is improved, but flexibility and breaking elongation deteriorate

Engineering Contradiction:
Improveheat resistanceVSAvoidbreaking elongation
Core Design Contradiction:
TemperatureVSStrength

Solution Approach 1:

The patent optimizes the chemical composition parameters by limiting aryl group content to 10-90 mol% of total organic groups and using specific ratios of organopolysiloxane components to achieve the desired balance between heat resistance and flexibility

Inventive Principle:
Principle #35Parameter changes

Solution Approach 2:

The patent creates a composite molecular structure combining organopolysiloxane chains with moderate aryl group content and crosslinking networks, where the crosslinking density and aryl group distribution are optimized to provide both thermal stability and mechanical flexibility

Inventive Principle:
Principle #40Composite materials

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The cured product from this composition exhibits excellent light transmittance, light diffusivity, and mechanical properties, such as high breaking elongation, making it suitable for various optical members, including encapsulants for LEDs and light diffusing materials for sensors.

Implementation Method 1

an organopolysiloxane having at least two radical reactive groups and/or reactive groups that can be cross-linked by a hydrosilylation reaction

Methodology Applied
Scientific EffectRadical polymerization: Photopolymerisation

Implementation Method 2

reactive groups that can be cross-linked by a hydrosilylation reaction

Methodology Applied
Scientific EffectHydrosilylation: Chemical Bonding

Implementation Method 3

inorganic fillers such as spherical silica or alumina particles... exhibits excellent light transmittance, light diffusivity

Methodology Applied
Scientific EffectLight scattering: Scattering

Data Source

PatentEP3979309B1Curable organopolysiloxane composition, and optical member formed from cured product of same
Publication Date: 2025.04.23 DOW TORAY CO LTD
  • EP3979309B1 patent drawingFigure 1~2
  • EP3979309B1 patent drawing
  • EP3979309B1 patent drawing

AI summary

[Problem] To provide a new light diffusing material having excellent light transmittance, light diffusivity, and mechanical properties. [RESOLUTION MEANS] The material of the present invention contains the following components A to C: A) an organopolysiloxane having at least two radical reactive groups and/or reactive groups that can be cross-linked by a hydrosilylation reaction within the molecule, where less than 0 to 10 mol% of total organic groups bonded to silicon atoms within the molecule are aryl groups; B) one or more inorganic fillers; C) an organosilicon compound that differs from component A, and contains one or more compound selected from the group consisting of the following C1 and C2: C1) an organosilicon compound that is different from component A, having in the molecule a reactive functional group that can bond with the reactive group of component A, a hydrolyzable silyl group and/or a silicon atom-bonded hydroxyl group, and two or more silicon atoms in the molecule; C2) an organosilicon compound that is different from component A, having a reactive functional group with 3 or more carbon atoms, which can bond with the reactive group of component A, a hydrolyzable silyl group and/or a silicon atom-bonded hydroxyl group in a molecule, and having one or more silicon atoms in the molecule; wherein the mass of the component B is 30 to 95% of the mass of the entire composition.