Silphenylene Photocurable Composition for Fine Optical Patterns
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional epoxy resin-based materials used in optical devices lack adequate light resistance for microfabrication, leading to issues like gas emission and discoloration when exposed to stronger light intensities, limiting their application in modern optical devices that require fine patterns and high transparency.
Innovation Solution
A silphenylene-containing photocurable composition, comprising a specific alicyclic epoxy-modified silphenylene compound and an optional epoxy group-containing organosilicon compound, allows for broad wavelength exposure, enabling the formation of fine patterns with excellent transparency and light resistance, and is used in a pattern formation method that includes exposure, development, and post-curing to produce optical semiconductor elements.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If epoxy resin-based materials are used for encapsulation in optical devices, then transparency and light resistance are improved, but manufacturing precision for microfabrication (10 μm or less) deteriorates
Solution Approach 1:
The patent changes the chemical composition parameters of the epoxy resin by introducing specific components: a silphenylene compound (component A) as the base resin, an alicyclic epoxy-modified silphenylene compound (component B) as modifier, and a sulfonium salt photoacid generator (component C). This compositional parameter change enables the material to achieve both high transparency/light resistance and fine pattern formation capability (10 μm or less) by optimizing the molecular structure and photo-reactivity of the resin system.
2Manufacturing precision
If conventional resist materials are used for microfabrication, then manufacturing precision is improved, but light resistance deteriorates, causing gas emission and discoloration under strong light intensity
Solution Approach 1:
The patent creates a composite photocurable composition by combining multiple components with complementary properties: component A (silphenylene compound) provides structural stability and light resistance, component B (alicyclic epoxy-modified silphenylene compound) enhances pattern formation and curability, and component C (sulfonium salt photoacid generator) enables photo-initiated crosslinking. This composite material system achieves both fine pattern formation (10 μm or less) and superior light resistance without gas emission or discoloration.
3Reliability
If epoxy-modified silicone resins are used for encapsulation, then transparency and light resistance are improved, but the ability to undergo microfabrication (10 μm or less) deteriorates
Solution Approach 1:
The patent modifies the epoxy resin system by incorporating component B (alicyclic epoxy-modified silphenylene compound) at 5-50 mass% of component A. This parameter change in composition introduces molecular structures that enhance both the optical properties (transparency and light resistance) and the photo-reactivity required for fine pattern formation, thereby resolving the contradiction between optical performance and microfabrication capability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The composition achieves high transparency, light resistance, and heat resistance, enabling the formation of very fine patterns (10 µm or less) suitable for protecting and encapsulating optical devices, with improved stability and performance compared to traditional materials.
Implementation Method 1
a photocurable composition described below, comprising a specific alicyclic epoxy-modified silphenylene compound, could be exposed with light across a broad range of wavelengths, enabling ready formation of a cured product with no oxygen inhibition
Data Source
Figure 1
AI summary
Provided is a silphenylene-containing photocurable composition including: (A) a specific silphenylene having both terminals modified with alicyclic epoxy groups, and (C) a photoacid generator that generates acid upon irradiation with light having a wavelength of 240 to 500 nm. Also provided is a pattern formation method including: (i) forming a film of the photocurable composition on a substrate, (ii) exposing the film through a photomask with light having a wavelength of 240 to 500 nm, and if necessary, performing heating following the exposure, and (iii) developing the film in a developing liquid, and if necessary, performing post-curing at a temperature within a range from 120 to 300°C following the developing. Further provided is an optical semiconductor element obtained by performing pattern formation using the method. The composition is capable of very fine pattern formation across a broad range of wavelengths, and following pattern formation, yields a film that exhibits a high degree of transparency and superior light resistance. The composition may also include: (B) a specific epoxy group-containing organosilicon compound.