Silphenylene Polyether Resin Coating for Chemical Resistance
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Solution Overview
Problem
Existing photosensitive silicone compositions used for protecting semiconductor devices and circuit boards lack sufficient chemical resistance and durability, particularly against photoresist strippers and thermal cycling tests, leading to peeling and cracking issues.
Innovation Solution
A photosensitive resin composition comprising a silphenylene and polyether structure-containing polymer with crosslinking groups, combined with a photoacid generator, crosslinker, solvent, and quencher, which forms a robust and adhesive coating with improved chemical resistance and crack resistance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If a photosensitive silicone composition is used to achieve low temperature curing and good moisture resistant adhesion, then adhesion is improved, but chemical resistance against photoresist strippers deteriorates
Solution Approach 1:
The patent employs a composite polymer structure combining silphenylene units (for chemical resistance) with polyether chains (for adhesion and flexibility). This composite approach at the molecular level allows the cured coating to simultaneously achieve both good adhesion to substrates and resistance to chemical attack from photoresist strippers, resolving the contradiction between these two properties.
2Object-affected harmful factors
If a silphenylene structure-containing silicone polymer is used to improve chemical resistance, then chemical resistance is improved, but adhesion and crack resistance deteriorate in thermal cycling tests
Solution Approach 1:
The patent modifies the polymer structure by incorporating flexible polyether chains between the rigid silphenylene units. This structural parameter change introduces molecular flexibility that allows the coating to accommodate thermal expansion and contraction during cycling, preventing cracks and maintaining adhesion while preserving the chemical resistance provided by the silphenylene structure.
3Object-affected harmful factors
If a photosensitive resin coating is formed to provide chemical resistance, then chemical resistance is improved, but pattern forming ability and film properties deteriorate
Solution Approach 1:
The patent incorporates crosslinking groups at specific locations within the polymer chain (every 2-20 repeating units) to create localized crosslinked regions. These local crosslinked zones provide chemical resistance and structural integrity, while the remaining non-crosslinked polyether segments maintain flexibility and processability, enabling good pattern forming ability and film properties.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The composition achieves enhanced adhesion, chemical resistance, and mechanical properties, ensuring reliable performance as a protective film and resist material for electronic parts, even under thermal cycling tests.
Implementation Method 1
a photoacid generator (B)
Data Source
AI summary
A photosensitive resin composition comprising (A) a silphenylene and polyether structure—containing polymer and (B) a photoacid generator is coated onto a substrate to form a photosensitive resin coating which has improved substrate adhesion, a pattern forming ability, crack resistance, and reliability as protective film.