Silphenylene Resin for Semiconductor Packages

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Solution Overview

Problem

Condensation curable silicone resin compositions used as semiconductor encapsulants face challenges with crack resistance, curing rate, heat resistance, and light resistance, particularly due to their brittleness and degradation when catalysts are added to enhance reactivity.

Innovation Solution

A condensation curable resin composition incorporating a silphenylene skeleton-bearing organosilicon compound with hydroxyl and/or alkoxy groups, combined with an organosilicon compound having a hydrogen atom and hydroxyl and/or alkoxy group, which cures quickly without a condensation catalyst, achieving improved hardness, crack resistance, heat resistance, and light resistance.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Productivity

If condensation catalyst is added to increase curing rate, then productivity is improved, but heat resistance and light resistance are degraded

Engineering Contradiction:

Improvecuring rateVSAvoidheat resistance and light resistance

Core Design Contradiction:

ProductivityVSReliability

Solution Approach 1:

The patent removes the condensation catalyst from the silicone resin composition, extracting the harmful element that causes degradation while maintaining curing functionality through the unique silphenylene skeleton structure that enables catalyst-free condensation reaction

Inventive Principle:

Principle #2Taking out (Extraction)

Solution Approach 2:

The patent changes the chemical structure parameter by incorporating a silphenylene skeleton into the silicone resin, which fundamentally alters the curing mechanism to proceed without catalyst while maintaining high heat and light resistance

Inventive Principle:

Principle #35Parameter changes

2Strength

If resin is softened to improve crack resistance, then crack resistance is improved, but gas barrier properties and handling ease are degraded

Engineering Contradiction:

Improvecrack resistanceVSAvoidgas barrier properties

Core Design Contradiction:

StrengthVSObject-affected harmful factors

Solution Approach 1:

The patent changes the molecular structure by incorporating silphenylene skeleton, which maintains resin hardness and gas barrier properties while the unique structure provides toughness and crack resistance without requiring softening of the resin

Inventive Principle:

Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The composition effectively cures into a product with enhanced mechanical properties, heat resistance, and light resistance, suitable for encapsulating semiconductor packages without the need for catalysts, thereby addressing the limitations of existing silicone resin compositions.

Implementation Method 1

condensation curable resin composition comprising (A) a silphenylene skeleton-bearing organosilicon compound having at least two hydroxyl and/or alkoxy groups per molecule

Methodology Applied

Scientific EffectCondensation reaction:

Data Source

PatentUS10179840B2Condensation curable resin composition and semiconductor package

Publication Date: 2019.01.15 SHIN ETSU CHEMICAL CO LTD

AI summary

A resin composition comprising (A) a silphenylene skeleton-bearing organosilicon compound containing at least two hydroxyl and/or alkoxy groups per molecule and (B) an organosilicon compound having a hydrogen atom and a hydroxyl and/or alkoxy group on a common silicon atom, or comprising (C) a silphenylene skeleton-bearing organosilicon compound having a hydrogen atom and a hydroxyl and/or alkoxy group on a common silicon atom is condensation curable without a need for catalysts. The cured product has satisfactory hardness, crack resistance, heat resistance and light resistance.