Silphenylene Silicone Resin Coating for Thermal Cycling and Chemical Resistance
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing photosensitive silicone compositions for semiconductor devices and printed circuit boards face issues with chemical resistance and thermal stability, as they tend to peel or crack during thermal cycling tests, and lack reliability as protective films.
Innovation Solution
A silicone structure-containing polymer with crosslinking groups or reactive sites is developed, forming a photosensitive resin composition that includes a base resin, a photoacid generator, and a crosslinker, which provides improved adhesion, crack resistance, and heat resistance, enabling the formation of a reliable protective film for electronic parts and circuit boards.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a photosensitive silicone composition is used for protection of semiconductor devices and circuit boards, then the coating is flexible and has good moisture resistant adhesion, but the chemical resistance against photoresist strippers such as NMP is insufficient
Solution Approach 1:
The patent uses a composite material system consisting of a silphenylene structure-containing silicone polymer combined with specific crosslinking agents and photoacid generators. This composite approach allows the cured coating to achieve both flexible adhesion and high chemical resistance against photoresist strippers like NMP, resolving the contradiction between moisture resistance and chemical resistance.
Solution Approach 2:
The patent modifies the chemical structure parameters by introducing silphenylene groups and controlling the crosslinking density through specific crosslinking agents. These parameter changes enable the coating to maintain flexibility while significantly improving chemical resistance, transforming the material properties to satisfy both requirements simultaneously.
2Object-affected harmful factors
If a photosensitive silicone composition based on silphenylene structure is used to improve chemical resistance, then the chemical resistance against photoresist strippers is improved, but the cured coating peels from substrate or cracks in thermal cycling test
Solution Approach 1:
The patent applies local quality by using silphenylene structures specifically at strategic positions within the polymer chain to provide chemical resistance, while maintaining flexible silicone backbone segments to ensure thermal cycling stability. This localized structural design allows different regions of the molecule to fulfill different functional requirements.
Solution Approach 2:
The patent introduces specific crosslinking agents as intermediaries that bridge the silphenylene structure-containing polymer chains. These crosslinking agents create a balanced network structure that prevents both peeling and cracking during thermal cycling, mediating between the rigid silphenylene units and the flexible silicone backbone.
3Reliability
If the coating is made thick to provide sufficient protection, then the protective function is enhanced, but the pattern forming ability and fine size definition are compromised
Solution Approach 1:
The patent creates a dynamic balance in coating thickness by optimizing the formulation to enable precise patterning at various thicknesses. The combination of silphenylene structure and controlled crosslinking allows the coating to maintain both protective function and pattern forming ability across a wide range of thicknesses, from thin to thick films.
Solution Approach 2:
The patent modifies formulation parameters including polymer molecular weight, crosslinking density, and photoacid generator concentration to achieve optimal performance. These parameter changes enable the coating to form precise fine patterns while maintaining sufficient thickness for protective function, resolving the contradiction between thickness and patterning precision.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The photosensitive resin composition and dry film exhibit enhanced film properties, including improved adhesion, mechanical strength, and electric insulation, withstanding thermal cycling and maintaining integrity as a protective film for electronic components.
Implementation Method 1
a photoacid generator which is decomposed to generate an acid upon exposure to light
Implementation Method 2
a silicone structure-containing polymer having crosslinking groups or crosslinking reaction-susceptible reactive sites in the molecule
Data Source
AI summary
A photosensitive resin composition comprising a silicone structure-containing polymer having crosslinking groups or crosslinking reaction-susceptible reactive sites in the molecule is coated onto a substrate to form a photosensitive resin coating which has improved substrate adhesion, a pattern forming ability, crack resistance, heat resistance, and reliability as protective film.