Heat-Dissipating Member Composition Using Silsesquioxane Bonding
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Solution Overview
Problem
Semiconductor devices operating at high temperatures face challenges with materials that lack sufficient heat resistance and thermal conductivity, leading to thermal distortion and reduced lifespan due to differences in thermal expansion coefficients and peeling of wiring.
Innovation Solution
A composition that forms a heat-dissipating member by directly bonding inorganic fillers using a coupling agent and bifunctional or higher silsesquioxane, achieving high thermal conductivity and heat resistance by propagating phonons and controlling thermal expansion coefficients.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If highly thermally conductive ceramic substrates or high heat resistance resins are used, then heat resistance is improved, but thermal conductivity is insufficient and processing difficulty increases
Solution Approach 1:
The invention uses a composite material consisting of inorganic filler particles (such as aluminum nitride, silicon nitride, or boron nitride) dispersed in a thermosetting resin matrix. This composite structure combines the high heat resistance of the resin with the high thermal conductivity of the inorganic fillers, achieving both heat resistance and thermal conductivity simultaneously while maintaining ease of processing through conventional molding techniques.
2Power
If operation temperature is increased to 200°C or higher, then power control capability is improved, but thermal distortion and peeling occur due to thermal expansion coefficient differences
Solution Approach 1:
The invention selects inorganic filler materials and resin matrices whose thermal expansion coefficients are closely matched to reduce thermal stress during temperature cycling. The composite structure allows for controlled thermal expansion behavior that minimizes distortion and prevents peeling of wiring at high operating temperatures of 200°C or higher.
3Ease of manufacture
If conventional resin materials are used, then ease of manufacture is maintained, but thermal conductivity is insufficient for efficient heat dissipation
Solution Approach 1:
The invention incorporates thermally conductive inorganic filler particles (such as aluminum nitride, silicon nitride, or boron nitride) into the resin matrix to create a composite material that maintains the ease of manufacture of conventional resins while dramatically improving thermal conductivity. The fillers are dispersed throughout the resin to create efficient heat conduction pathways without complicating the manufacturing process.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The heat-dissipating member exhibits very high thermal conductivity, excellent chemical stability, hardness, and mechanical strength, suitable for applications in electronic instruments, reducing thermal distortion and extending lifespan.
Implementation Method 1
it is possible to form a heat-dissipating member that has very high heat resistance (a glass transition temperature and a decomposition temperature) of about 350° C. or higher and has thermal conductivity, and thereby completed the present invention
Data Source
AI summary
This invention is a composition capable of forming a heat-dissipating member that has high heat resistance and high thermal conductivity. This composition for a heat-dissipating member comprises a thermally conductive first inorganic filler bonded to one end of a first coupling agent, and a thermally conductive second inorganic filler bonded to one end of a second coupling agent, the composition being characterized in that: the other end of the first coupling agent and the other end of the second coupling agent are each bonded to a bifunctional or higher silsesquioxane by a curing treatment, as illustrated in FIG. 2; or at least one of the first coupling agent and the second coupling agent includes, in the structure thereof, a silsesquioxane, and the other end of the first coupling agent and the other end of the second coupling agent are bonded together as illustrated in FIG. 3.