Silsesquioxane Patterning Coating for Selective Electrode Deposition
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Solution Overview
Problem
Existing opto-electronic devices, such as OLEDs, face challenges in achieving efficient and selective deposition of conductive coatings, particularly in creating patterned electrodes for sub-pixel emissive regions.
Innovation Solution
A layered semiconductor device is disclosed, featuring a patterning coating with silsesquioxane groups, including fluorine-containing moieties, applied in a first portion of the device's lateral aspect. This coating impacts the propensity of a vapor flux of deposited material to condense, allowing for selective deposition of a closed coating of deposited material in a second portion, forming a second electrode.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If conventional vacuum-based deposition processes are used for forming conductive coatings, then deposition can be achieved, but selective deposition in patterned regions is difficult and manufacturing precision deteriorates
Solution Approach 1:
A patterning coating is deposited beforehand on the substrate in the regions where conductive coating deposition is desired. This preliminary patterning layer serves as a template that guides the subsequent selective deposition of conductive materials, enabling precise pattern formation without requiring complex mask alignment procedures during the actual conductive layer deposition
Solution Approach 2:
The patterning coating acts as an intermediary layer between the substrate and the conductive coating. This intermediate layer controls the deposition process by allowing vapor flux to condense selectively on patterned regions, thereby mediating the transfer of the desired pattern from the patterning coating to the conductive coating layer
2Reliability
If patterned electrodes are formed for sub-pixel emissive regions, then emission control is improved, but deposition selectivity becomes more challenging
Solution Approach 1:
The patterning coating is deposited in advance to define the precise patterns for sub-pixel emissive regions. This preliminary pattern definition ensures that subsequent conductive coating deposition occurs only in the intended areas, achieving both high emission control reliability and deposition selectivity
Solution Approach 2:
The patterning coating provides locally differentiated properties across the substrate surface, creating regions with different deposition characteristics. This local quality variation enables selective condensation of vapor flux only in specific patterned regions corresponding to sub-pixel emissive areas, achieving precise spatial control over conductive coating formation
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enables improved selective deposition of conductive coatings, enhancing the formation of patterned electrodes in opto-electronic devices, which leads to more efficient emission of electromagnetic radiation and better control over sub-pixel emissive regions.
Implementation Method 1
The compound may have a characteristic surface energy of no more than about 25 dynes/cm
Data Source
AI summary
A compound, and a layered semiconductor device comprising a patterning coating provided in a first portion of a lateral aspect of the device, the patterning coating comprising the compound. The patterning coating is adapted to impact a propensity of a vapor flux of a deposited material to be condensed thereon. The compound comprises a plurality of silsesquioxane groups, including without limitation, first and second silsesquioxane groups and a linker group bonded to the first silsesquioxane group and the second silsesquioxane group, wherein at least one of the first and second silsesquioxane groups comprises a fluorine-containing moiety. The device comprises a deposited layer provided in a second portion of the lateral aspect of the device, the deposited layer comprising the deposited material.