Silver-Particle Conductive Adhesive for Low-Resistance Sintering
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Solution Overview
Problem
Sintered bodies of electrically conductive adhesives containing thermosetting resins and silver particles exhibit high specific resistance values due to the presence of the thermosetting resin.
Innovation Solution
Incorporating a silver particle with a protective layer containing a specific compound represented by the general formula (R1 = alkyl group with 1 to 5 carbon atoms, R2 = hydrogen or alkyl group with 1 to 5 carbon atoms) into the electrically conductive adhesive, along with a thermosetting resin, to form a sintered body with low specific resistance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If a thermosetting resin is added to the electrically conductive adhesive to enable non-pressurizing bonding, then the bonding process becomes simpler and more efficient, but the specific resistance value of the sintered body increases
Solution Approach 1:
A compound with specific chemical structure (formula (1)) is introduced as an intermediary substance between the silver particles and thermosetting resin. This compound modifies the interface properties, allowing the resin to bond the substrate without creating excessive insulating barriers that would increase electrical resistance. The compound acts as a mediator that reconciles the electrical conductivity requirement with the bonding functionality.
Solution Approach 2:
The chemical composition and surface properties of silver particles are modified by coating them with a compound having specific molecular structure (formula (1) with R1 and R2 being alkyl groups with 1-5 carbon atoms). This parameter change in the particle surface chemistry enables the particles to maintain low resistance even in the presence of thermosetting resin, which would otherwise increase resistance.
2Reliability
If the content ratio of silver particles is increased to reduce specific resistance, then the electrical conductivity improves, but the cost and material complexity increase
Solution Approach 1:
Instead of simply increasing silver content, the invention changes the surface parameters of silver particles by coating them with a specific compound (formula (1)). This modifies the electrical and bonding properties of the particles themselves, allowing effective conductivity at lower silver content ratios, thus reducing material cost and simplifying composition.
Solution Approach 2:
The invention creates a composite structure where silver particles are coated with a specific organic compound (formula (1)). This composite particle structure combines the electrical conductivity of silver with the bonding and protective properties of the organic coating, achieving low resistance without requiring high silver content, thereby simplifying the overall material composition.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The resulting sintered body achieves a low specific resistance value, enabling effective bonding of electronic components without the need for pressure during sintering.
Implementation Method 1
a silver particle having a protective layer containing a specific compound... sintering the electrically conductive adhesive... a sintered body having a low specific resistance value
Data Source
AI summary
Provided is a novel electrically conductive adhesive which can yield a sintered body having low resistivity despite containing a thermosetting resin in addition to silver particles. This electrically conductive adhesive contains silver particles and a thermosetting resin. The silver particles are provided with a protective layer that contains a compound represented by general formula (1).[In general formula (1), R1 is an alkyl group having 1-5 carbon atoms, and R2 is a hydrogen atom or an alkyl group having 1-5 carbon atoms.]