Silver Bonding Layer Coating for Corrosion-Resistant Semiconductor Joining
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Solution Overview
Problem
Semiconductor devices face issues with corrosion due to sulfur ions in corrosive environments, leading to deterioration in adhesion and strength at silver-containing bonding material layers, particularly in power semiconductor modules with copper or copper alloy components.
Innovation Solution
A semiconductor joining method involving a silver-containing bonding material layer with a corrosion inhibitor coating layer, preferably benzotriazole or its derivatives, amine carboxylates, or nitrites, applied to prevent corrosion by covering the silver-containing bonding material layers, ensuring a thickness of 1 nm to 10 nm to prevent ion migration and enhance bonding strength.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If a silver-containing bonding material layer is used to bond semiconductor constituent members, then bonding strength is improved, but corrosion resistance deteriorates due to ion migration in corrosive environments
Solution Approach 1:
A corrosion inhibitor coating layer is introduced as an intermediary between the silver-containing bonding material layer and the corrosive environment. This coating layer acts as a barrier that prevents sulfur ions and other corrosive substances from reaching the silver-containing bonding material, thereby preventing ion migration and corrosion while maintaining the bonding strength provided by the silver-containing bonding material layer
2Reliability
If copper or copper alloy members are used in semiconductor devices, then electrical conductivity is improved, but corrosion resistance deteriorates due to oxidation and reaction with sulfur ions
Solution Approach 1:
A corrosion inhibitor coating layer is applied to the copper or copper alloy members to serve as a protective intermediary. This coating layer prevents direct contact between the copper surface and corrosive substances such as sulfur ions and oxygen, thereby preventing oxidation and corrosion while preserving the excellent electrical conductivity of the copper members
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The method effectively suppresses ion migration and corrosion, providing high bonding strength and reliability in semiconductor devices, especially when used in conjunction with silicone gel sealing materials.
Implementation Method 1
a corrosion inhibitor coating layer that is in contact with the silver-containing bonding material layer
Data Source
AI summary
The present invention provides a joining that suppresses ion migration and also has excellent corrosion resistance, high bonding strength, and high reliability at the joining, and a semiconductor device. The present invention provides semiconductor joinings comprising: at least two semiconductor constituent members; and silver-containing bonding material layers that bond the semiconductor constituent members, in which a corrosion inhibitor coating layer is provided in contact with the silver-containing bonding material layers, and a semiconductor device including the same.