Silver Catalyst Resin for Fine EMI Shielding Patterns
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Solution Overview
Problem
Existing methods for forming electromagnetic wave shielding layers on displays face challenges such as high surface resistance, limited accuracy in printed circuits, infiltration of conductive materials into irregular portions, complexity in the process, and the use of expensive palladium catalysts, which hinder the formation of fine patterns and lead to issues during electroless plating.
Innovation Solution
A resin composition comprising an organic polymer resin, a polyfunctional monomer with ethylenically unsaturated bonds, a photoinitiator, and a silver organic complex precursor is used, which is coated on a substrate, exposed to light, developed, reduced, and subjected to electroless plating to form a fine metal pattern with improved adhesiveness and deposition characteristics, avoiding the use of expensive palladium and reducing catalyst loss during wet processes.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If a metal or metal oxide is deposited on a transparent substrate to form a conductive thin film, then the electromagnetic wave shielding effect is improved, but the surface resistance increases excessively when the film is made thin to achieve transparency
Solution Approach 1:
The patent applies local quality by creating a patterned conductive film structure where metal particles are selectively distributed in specific regions rather than forming a continuous thin film. This allows the film to maintain transparency in non-conductive areas while providing sufficient conductivity and shielding effect in patterned regions through optimized particle density and distribution.
Solution Approach 2:
The patent uses composite materials by combining metal particles with a transparent resin matrix to form a patterned conductive film. This composite structure enables the film to simultaneously achieve transparency, appropriate surface resistance, and electromagnetic wave shielding effect by controlling the metal particle concentration, size, and spatial distribution within the resin.
2Ease of manufacture
If a conductive paste is patterned by printing technique, then the electromagnetic wave shielding film can be formed, but the accuracy of printed circuits is limited and conductive materials infiltrate into irregular portions
Solution Approach 1:
The patent replaces the mechanical printing process with a photolithography-based patterning method. Instead of relying on screen printing or offset printing mechanics that cause material infiltration and limited precision, the invention uses light exposure through a photomask to define precise patterns, eliminating mechanical contact and achieving higher manufacturing precision for conductive circuit patterns.
Solution Approach 2:
The patent applies parameter changes by transitioning from paste-based printing to a photosensitive resin system that undergoes chemical transformation upon light exposure. This changes the fundamental parameter of pattern formation from mechanical deposition to photochemical development, enabling precise pattern definition without material infiltration issues.
3Object-affected harmful factors
If a metal layer is formed by photodevelopment and subjected to electroplating, then the electromagnetic wave shielding film can be formed, but the process becomes complicated requiring formation of several layers
Solution Approach 1:
The patent merges multiple process steps into a single integrated system. By incorporating the catalyst precursor directly into the photosensitive resin composition, the invention combines the photodevelopment step with the electroless plating catalyst function, eliminating the need for separate metal layer formation and electroplating steps, thus reducing overall process complexity while maintaining shielding film formation capability.
4Object-affected harmful factors
If a metal catalyst is mixed with a photosensitive resin, then the electromagnetic wave shielding film can be formed, but expensive palladium catalyst is required and problems arise during fine pattern formation and electroless plating
Solution Approach 1:
The patent applies this principle by replacing expensive palladium catalyst with a cheaper alternative catalyst system that is integrated into the photosensitive resin. The use of cost-effective catalyst precursors that can be disposed of or regenerated reduces material loss concerns and overall process cost while maintaining effective electroless plating functionality.
Solution Approach 2:
The patent uses an intermediary approach by incorporating the catalyst precursor within the photosensitive resin matrix before photodevelopment. This intermediary positioning allows the catalyst to be precisely delivered to the patterned areas during the development process, preventing catalyst loss during wet processes and enabling fine pattern formation without the problems associated with pre-mixed metal catalyst systems.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The method enables the formation of uniform, fine metal patterns with enhanced adhesiveness and deposition rates, effectively shielding electromagnetic waves while preventing catalyst loss during processing, suitable for use in various displays and flexible printed circuit boards.
Implementation Method 1
a photoinitiator
Implementation Method 2
reduced, and subjected to electroless plating
Implementation Method 3
subjected to electroless plating to form a fine metal pattern
Data Source
AI summary
Disclosed is a resin composition which comprises a catalyst precursor for electroless plating to form an electromagnetic wave shielding layer. The resin composition comprises an organic polymer resin, a polyfunctional monomer having an ethylenically unsaturated bond, a photoinitiator, a silver organic complex precursor as a catalyst precursor, and an organic solvent. Further disclosed are methods for forming metal patterns using the resin composition and metal patterns formed by the methods. The methods comprise forming a pattern, reducing the pattern, and electroless plating the reduced pattern. A patterned layer of the catalyst formed using the resin composition is highly adhesive, a loss of the catalyst during a wet process is substantially prevented, and an increase in plating rate leads to the formation of a uniform, fine metal pattern after electroless plating. Electromagnetic wave shielding materials comprising the metal pattern can be used in the formation of films for shielding electromagnetic waves.