Non-aqueous Silver Catalytic Composition for Conductive Films

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Solution Overview

Problem

Current methods for producing electrically-conductive films, particularly for touch screen displays, face challenges with the use of Indium Tin Oxide (ITO) due to its high cost, limited availability, and requirement for vacuum deposition, and struggle with achieving uniform silver particle dispersion for electroless plating, leading to inefficiencies in high-speed manufacturing.

Innovation Solution

A non-aqueous metal catalytic composition comprising reducible silver ions, oxyazinium salt silver ion photoreducing agents, hindered pyridine, and photocurable components, which generates silver particles in situ, eliminating the need for pre-dispersion and allowing for high-speed, continuous production of electrically-conductive patterns through electroless plating.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Manufacturing precision

If silver particles are pre-dispersed in the coating composition, then uniform distribution is achieved, but the manufacturing process becomes complex and time-consuming

Engineering Contradiction:
Improveuniformity of silver particle distributionVSAvoidcomplexity of dispersant processes
Core Design Contradiction:
Manufacturing precisionVSDevice complexity

Solution Approach 1:

The coating composition contains reducible silver ions that automatically reduce to form silver particles in-situ during the electroless plating process, eliminating the need for external dispersant processes. The silver ions serve their own function as both the source of conductive material and the catalyst for particle formation, simplifying the manufacturing process while maintaining uniform distribution.

Inventive Principle:
Principle #25Self-service

Solution Approach 2:

The coating composition is prepared with reducible silver ions already incorporated into the matrix before application. This preliminary incorporation ensures that when reduction occurs during plating, silver particles form uniformly throughout the coating without requiring complex post-application dispersal processes.

Inventive Principle:
Principle #10Preliminary action

2Reliability

If ITO is used as the conductive material, then the conductive film can be produced, but the cost increases and availability is limited

Engineering Contradiction:
Improveconductive film productionVSAvoidcost and availability of Indium
Core Design Contradiction:
ReliabilityVSQuantity of substance

Solution Approach 1:

The invention replaces expensive, scarce Indium Tin Oxide with silver, which is more abundant and cost-effective. Silver provides superior conductivity (50-100 times greater than ITO) and is available from numerous sources, making it an economically viable alternative despite requiring different processing methods.

Inventive Principle:
Principle #27Cheap short-living objects (Disposable)

3Manufacturing precision

If vacuum deposition is used for ITO, then the conductive layer is formed, but the processing temperature increases and equipment complexity increases

Engineering Contradiction:
Improveconductive layer formationVSAvoidprocessing temperature
Core Design Contradiction:
Manufacturing precisionVSTemperature

Solution Approach 1:

The invention replaces the mechanical vacuum deposition process with a chemical electroless plating process. Instead of physically depositing material in a vacuum, the conductive silver layer is formed through chemical reduction of silver ions in the coating composition, eliminating the need for vacuum equipment and high-temperature processing.

Inventive Principle:
Principle #28Mechanics substitution (Replace mechanical system)

4Reliability

If silver particles are used for electroless plating, then conductivity is improved, but uniform particle dispersion is difficult to achieve

Engineering Contradiction:
ImproveconductivityVSAvoiduniformity of particle dispersion
Core Design Contradiction:
ReliabilityVSManufacturing precision

Solution Approach 1:

The coating composition contains reducible silver ions that automatically reduce to form silver particles in-situ during the electroless plating process, eliminating the need for external dispersant processes. The silver ions serve their own function as both the source of conductive material and the catalyst for particle formation, simplifying the manufacturing process while maintaining uniform distribution.

Inventive Principle:
Principle #25Self-service

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach enables the production of uniform electrically-conductive films with improved conductivity and reduced manufacturing complexity, using silver as a more cost-effective and abundant conductor, while avoiding the limitations of ITO and complex dispersant processes.

Implementation Method 1

an oxyazinium salt silver ion photoreducing agent

Methodology Applied
Scientific EffectPhotoreduction: Reduction

Implementation Method 2

photosensitizer

Methodology Applied
Scientific EffectPhotosensitization: Absorption (EM radiation)

Data Source

PatentUS9624582B2Non-aqueous metal catalytic composition with oxyazinium photoreducing agent
Publication Date: 2017.04.18 EASTMAN KODAK CO
  • US9624582B2 patent drawing
  • US9624582B2 patent drawing
  • US9624582B2 patent drawing

AI summary

A non-aqueous metal catalytic composition includes (a) a silver complex comprising reducible silver ions, (b) an oxyazinium salt silver ion photoreducing agent, (c) a hindered pyridine, (d) a photocurable component, a non-curable polymer, or combination of a photocurable component and a non-curable polymer, and (e) a photo sensitizer different from all components (a) through (d) in the non-aqueous metal catalytic composition, in an amount of at least 1 weight %. This non-aqueous metal catalytic composition can be used to form silver metal particles in situ during suitable reducing conditions. The silver metal can be provided in a suitable layer or pattern on a substrate, which can then be subsequently subjected to electroless plating to form electrically-conductive layers or patterns for use in various articles or as touch screen displays in electronic devices.