Silver-Coated Copper Nanowire Epoxy Paste for Low Resistance
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Solution Overview
Problem
Conductive pastes, particularly epoxy resin-based compositions, face challenges with high costs, brittleness, and long curing times, and require immediate mixing of components, limiting their usability and performance in forming electrodes and wiring with low resistance and high electromagnetic interference shielding effectiveness.
Innovation Solution
An epoxy paste composition incorporating silver-coated copper nanowires with a core-shell structure, combined with an epoxy resin and a curing agent, which can be applied at low temperatures and cured quickly, offering improved adhesion, conductivity, and economic efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If silver powder is used as conductive filler, then electrical conductivity is improved, but cost increases and physical properties deteriorate
Solution Approach 1:
The patent employs a core-shell structured composite material where a copper nanowire core is coated with a silver shell. This composite structure combines the high electrical conductivity of silver with the cost-effectiveness and mechanical strength of copper, achieving low specific resistance while reducing material cost and improving physical properties such as brittleness resistance.
Solution Approach 2:
The silver coating is applied locally on the surface of the copper nanowire core rather than using bulk silver. This localized application of silver provides the necessary electrical conductivity at the contact points and surface, while the copper core provides structural support and cost efficiency, optimizing both electrical and mechanical properties.
2Reliability
If 2-component epoxy resin is used, then conductivity can be achieved, but usability deteriorates due to immediate mixing requirement
Solution Approach 1:
The epoxy resin and curing agent are pre-mixed in a single-component formulation with the conductive filler, eliminating the need for immediate mixing before use. This preliminary preparation allows the product to be stored ready-to-use while maintaining stability, improving usability without sacrificing the conductive properties.
Solution Approach 2:
The patent merges the epoxy resin, curing agent, and conductive filler into a single integrated composition. This combination eliminates the separate components and mixing step required in 2-component systems, simplifying the application process while maintaining the conductive and adhesive properties of the epoxy system.
3Reliability
If large amount of conductive powder is used, then conductivity is improved, but cost increases and physical properties worsen
Solution Approach 1:
The patent changes the physical parameters of the conductive filler by using nanowire-shaped particles with high aspect ratios instead of conventional powder. This parameter change allows achieving percolation and conductivity at lower filler concentrations, reducing the amount of expensive conductive material needed while maintaining electrical performance and improving mechanical properties.
Solution Approach 2:
The core-shell composite structure maximizes the conductive efficiency of the filler particles. The silver-coated copper nanowire configuration provides effective electrical pathways with minimal material usage, achieving good conductivity at lower filler loading compared to conventional powder, thus reducing cost and improving physical properties.
4Ease of manufacture
If conventional conductive paste is used, then electrodes and wiring can be formed, but curing time increases
Solution Approach 1:
The patent modifies the chemical parameters of the epoxy system by selecting specific epoxy resin types and curing agents that enable fast curing reactions. This parameter optimization allows the paste to achieve adequate cure strength in reduced time, accelerating production cycles while maintaining the ability to form quality electrodes and wiring structures.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The composition achieves low specific resistance and high electromagnetic interference shielding effectiveness, enabling its use in various applications such as electromagnetic interference shielding, electrodes, and electronic circuits with enhanced electrical conductivity and productivity.
Implementation Method 1
silver-coated copper nanowire having core-shell structure... excellent electrical characteristic... low specific resistance
Implementation Method 2
epoxy resin-based conductive paste including an epoxy resin, in which a conductive metal powder is dispersed, and a curing agent
Implementation Method 3
performed by applying an epoxy paste composition including a silver-coated copper nanowire having a core-shell structure on a substrate, and then performing a heat treatment
Data Source
AI summary
The present invention relates to an epoxy paste composition including silver-coated copper nanowires having a core-shell structure, and a conductive film including the same.