Silver-Coated Copper Conductive Resin for MLCC Electrodes
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Solution Overview
Problem
The high manufacturing costs of multilayer ceramic capacitors due to the use of expensive silver (Ag) in conductive resin compositions, combined with issues such as crack occurrence of external electrodes and permeation of plating solutions, which affect the reliability of these components, especially in miniaturized and ultrahigh-capacitance applications.
Innovation Solution
A conductive resin composition comprising epoxy resin, copper powder particles with silver-coated surfaces, and non-nitrogen-based hardeners like phenolic or anhydride hardeners, along with additives for necking formation, is used to form conductive resin layers on external electrodes, reducing the need for silver and enhancing reliability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If silver (Ag) is used as the conductive resin composition, then conductivity and reliability are improved, but manufacturing cost increases
Solution Approach 1:
The patent uses a composite conductive resin composition comprising silver-coated copper powder particles, epoxy resin, and non-nitrogen-based hardener. This composite structure combines the high conductivity of silver (on the surface) with the cost-effectiveness of copper (in the core), while the epoxy resin matrix provides structural integrity and prevents plating solution permeation. This resolves the contradiction by achieving both reliability and cost reduction through material composition optimization.
Solution Approach 2:
The conductive resin composition applies local quality by coating only the surface of copper powder particles with silver, rather than using pure silver throughout. This creates a localized silver layer that provides the necessary conductivity and reliability at the critical interface, while the copper core reduces overall material cost. The epoxy resin is locally distributed to provide structural support and protection where needed.
2Ease of manufacture
If copper powder particles are used instead of silver, then manufacturing cost is reduced, but conductivity and reliability deteriorate
Solution Approach 1:
The patent creates a composite structure with silver-coated copper powder particles where the silver coating layer provides excellent conductivity and reliability at the critical contact points, while the copper core maintains cost-effectiveness. This composite approach ensures that the essential conductive properties are preserved at the surface level where they are most needed, while reducing overall material costs.
Solution Approach 2:
The silver coating is applied locally on the surface of copper powder particles rather than throughout the entire particle volume. This localized application ensures that conductivity and reliability are maintained at the critical interface with the plating solution, while the copper core provides cost savings. The epoxy resin is also locally distributed to provide structural support and prevent plating solution permeation at critical locations.
3Volume of moving object
If external electrodes are made thin for miniaturization, then capacitor size is reduced, but crack occurrence increases
Solution Approach 1:
The patent applies beforehand cushioning by forming a conductive resin layer comprising epoxy resin and silver-coated copper powder particles on the external electrodes before the plating process. This resin layer acts as a cushioning layer that absorbs external impacts and prevents crack propagation in the thin external electrodes, thereby maintaining reliability while enabling miniaturization.
Solution Approach 2:
The conductive resin layer is a composite material consisting of epoxy resin matrix and silver-coated copper powder particles. This composite structure provides both mechanical strength to prevent cracking and electrical conductivity for proper function. The epoxy resin provides a flexible matrix that can absorb stress, while the conductive particles maintain electrical pathways, resolving the contradiction between thin electrode design and crack resistance.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach reduces product manufacturing costs while maintaining reliability by using copper powder particles coated with silver, improving conductivity and preventing plating solution permeation, thus addressing the challenges of crack occurrence and permeation in multilayer ceramic capacitors.
Implementation Method 1
copper (Cu) powder particles... improving conductivity
Implementation Method 2
preventing plating solution permeation
Implementation Method 3
external impacts are absorbed... by applying a resin composition
Data Source
AI summary
There is provided a conductive resin composition including epoxy resin, copper powder particles, and non-nitrogen-based hardeners.