Silver Coating Solderability via Mercapto Silane Treatment

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Solution Overview

Problem

Existing methods for enhancing solderability of copper surfaces in printed circuit boards, such as hot air solder leveling and precious metal plating, are inefficient, expensive, and prone to corrosion, especially when exposed to sulfur-containing environments, leading to unreliable solder connections.

Innovation Solution

A process involving immersion or electroless silver plating followed by a treatment with a mercapto or thio silane compound to create a corrosion-resistant silver coating, which improves solderability and adhesion while being cost-effective and versatile.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If silver plating is used to enhance solderability, then solderability is improved, but corrosion resistance deteriorates in sulfur-containing environments

Engineering Contradiction:
ImprovesolderabilityVSAvoidcorrosion resistance
Core Design Contradiction:
ReliabilityVSObject-affected harmful factors

Solution Approach 1:

The patent applies a composite coating structure consisting of a silver layer combined with a corrosion-resistant layer (such as palladium, rhodium, or other protective coatings). This composite structure allows the silver to provide excellent solderability while the outer corrosion-resistant layer protects against sulfur-containing environments, thereby resolving the contradiction between improved solderability and deteriorated corrosion resistance.

Inventive Principle:
Principle #40Composite materials

2Object-affected harmful factors

If precious metal plating (nickel-gold) is used to prevent corrosion, then corrosion resistance is improved, but cost increases significantly

Engineering Contradiction:
Improvecorrosion resistanceVSAvoidcost
Core Design Contradiction:
Object-affected harmful factorsVSQuantity of substance

Solution Approach 1:

The patent applies corrosion-resistant coatings selectively only to areas where corrosion protection is needed, rather than plating the entire surface with expensive precious metals. The silver plating provides solderability where needed, while corrosion-resistant coatings are applied locally to protect against environmental degradation, thereby reducing material costs while maintaining both solderability and corrosion resistance.

Inventive Principle:
Principle #3Local quality

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The proposed process results in a silver coating that is more resistant to corrosion and provides superior solderability, exceeding the performance of traditional nickel-gold plating methods, with significant improvements in reliability and longevity of solder bonds, especially under adverse conditions.

Implementation Method 1

treating the metal surface with an immersion or electroless silver plating solution

Methodology Applied
Scientific EffectImmersion plating: Deposition (physical)

Implementation Method 2

treating the metal surface with an immersion or electroless silver plating solution

Methodology Applied
Scientific EffectElectroless plating: Deposition (physical)

Implementation Method 3

treating the silver plated surface with a solution which comprises a mercapto or thio silane compound

Methodology Applied
Scientific EffectChemical bonding: Chemical Bonding

Data Source

PatentEP2342372B1Method for enhancing the solderability of a surface
Publication Date: 2018.05.02 MACDERMID INC
  • EP2342372B1 patent drawing
  • EP2342372B1 patent drawing
  • EP2342372B1 patent drawing

AI summary

A method for enhancing the solderab?ity of a metallic surface is disclosed where the metallic surface is plated with a silver plate prior to soldering, which immersion silver plate is treated with an additive comprising a mercapto substituted or thio substituted silane compound. Preferred post treatments comprise 3-mercapto propyl trimethoxysilane and/or 3-oxtanoylthio-1-propyltriethoxy silane.