Silver Conductive Substrate Iodine Ratio Migration Suppression
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Solution Overview
Problem
Conductive substrates with thin wires used in touch panels face challenges in achieving both excellent conductivity and effective migration suppression, as existing methods struggle to maintain low electrical resistance while preventing unwanted electrical conductivity between wires.
Innovation Solution
A conductive substrate with a silver thin wire that has a specific iodine-to-silver atom ratio of 0.035 to 0.100, measured by fluorescent X-ray analysis, and a line width of 0.1 μm to 5.0 μm, with a substrate material such as polyethylene terephthalate, and an electroless silver plating treatment using a plating liquid containing potassium iodide and a reducing agent, ensuring a CKI/CR ratio of 0.7 or less.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If the wire is thinned to reduce line width, then productivity and design flexibility are improved, but migration resistance deteriorates
Solution Approach 1:
The invention changes the chemical composition parameters of the conductive thin wire by controlling the iodine-to-silver atom ratio to be 0.035 to 0.100. This parameter change allows the wire to maintain both thin dimensions (0.1 μm to less than 5.0 μm line width) and high migration resistance, resolving the contradiction between wire thinning and migration protection.
Solution Approach 2:
The conductive thin wire is formed as a composite structure containing silver particles and iodine compounds. This composite material approach enables the wire to achieve both thin line width for high productivity and the specific compositional ratio needed for migration resistance, simultaneously addressing both requirements.
2Ease of manufacture
If conventional plating treatments are used, then manufacturing process is simple, but conductivity and migration suppression performance are insufficient
Solution Approach 1:
The invention modifies the plating treatment parameters by using a plating liquid containing potassium iodide and controlling the iodine-to-silver atom ratio to be 0.035 to 0.100. This parameter change in the plating process achieves both excellent conductivity and migration suppression performance while maintaining the simplicity of the electroless plating manufacturing process.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution provides a conductive substrate with enhanced conductivity and improved migration suppression performance, maintaining low electrical resistance and preventing electrical conductivity issues between wires.
Implementation Method 1
a step 2 of subjecting the metal-containing layer to an electroless plating treatment to form the conductive thin wire
Implementation Method 2
a plating treatment liquid used for the electroless plating treatment contains potassium iodide and a reducing agent
Implementation Method 3
a ratio of an amount of iodine atoms to an amount of silver atoms, which is detected in a case where a surface of the conductive thin wire is measured by a fluorescent X-ray analysis method
Data Source
AI summary
A conductive substrate having excellent conductivity and excellent migration suppressing performance, and a manufacturing method for the conductive substrate. The conductive substrate includes a substrate and a conductive thin wire that contains silver and is disposed on the substrate, where a ratio of an amount of iodine atoms to an amount of silver atoms, which is detected in a case where a surface of the conductive thin wire is measured by a fluorescent X-ray analysis method, is 0.035 to 0.100.