Silver-Copper Lateral Composite Strip With Stronger Interfacial Bonding
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Solution Overview
Problem
Existing methods for producing silver-copper composite strips for fuses face issues with weak bonding, complex production processes, and high costs, leading to insufficient interaction between silver and copper, and difficulties in achieving uniformity and scalability.
Innovation Solution
A method involving a concave roller set with grooves in a four-roller solid-phase rolling mill, where copper and silver bars are arranged in an alternating pattern within a copper frame, followed by surface treatment, cold bonding, diffusion annealing, and multi-pass rolling to enhance bonding strength and simplify the production process.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If the inlay method with cold bonding is used to manufacture silver-copper composite strip, then the composite material can be produced, but the bonding strength between silver and copper is weak due to insufficient interaction between the materials
Solution Approach 1:
The patent applies preliminary action by performing surface treatment (sandblasting, grinding, or shot blasting) on the silver strip and copper plate before bonding. This pre-treatment creates surface roughness and increases surface area, enhancing the interaction between materials and ensuring strong bonding without requiring complex multi-pass processing
Solution Approach 2:
The patent changes the bonding temperature parameter by heating the copper plate to 100-500°C during the cold bonding process. This temperature parameter change enhances the diffusion and interaction between silver and copper atoms at the interface, significantly improving bonding strength while maintaining a relatively simple single-pass production process
2Strength
If the copper plate is processed several times in the production process to improve bonding, then the bonding strength may improve, but the production process becomes cumbersome and complicated
Solution Approach 1:
The patent performs all necessary surface preparation (sandblasting, grinding, or shot blasting) as preliminary actions before the single bonding pass. This eliminates the need for multiple processing passes while ensuring strong bonding, thereby simplifying the production process and reducing equipment complexity
Solution Approach 2:
The patent combines surface treatment and bonding operations into a single integrated process step. By merging these operations and performing them in one pass with proper surface preparation and temperature control, the patent eliminates the need for separate multiple processing steps, reducing production complexity
3Productivity
If the inlay method is used for production, then the composite strip can be manufactured, but the non-rolling direction of the material strip cannot be restrained, causing insufficient interaction between silver and copper
Solution Approach 1:
The patent introduces a heating mechanism as an intermediary element during the bonding process. By heating the copper plate to 100-500°C, it enhances the atomic diffusion and interaction between silver and copper, ensuring strong bonding while maintaining the continuous single-pass production efficiency of the rolling process
Solution Approach 2:
The patent changes the temperature parameter of the copper plate during bonding to 100-500°C. This parameter change enhances material interaction and bonding strength without disrupting the continuous rolling process, thereby maintaining high production efficiency while achieving strong bonding
4Strength
If alternative methods are used to improve bonding strength, then the bonding quality improves, but the production cost increases
Solution Approach 1:
The patent uses moderate temperature heating (100-500°C) during bonding as a cost-effective parameter change. This approach significantly improves bonding strength through enhanced atomic diffusion without requiring expensive extreme high-temperature equipment or complex multi-pass processing, thereby achieving strong bonding at reasonable production cost
Solution Approach 2:
The patent applies cost-effective surface treatment methods (sandblasting, grinding, or shot blasting) as preliminary actions before bonding. These relatively low-cost surface preparation techniques create sufficient surface roughness and area to ensure strong bonding without requiring expensive additional processing steps or materials
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach significantly improves the bonding strength between silver and copper, simplifies the production process, reduces production cycle time, and enables large-scale production of high-quality composite strips with enhanced mechanical properties.
Implementation Method 1
manufacturing a copper frame having a fixed width according to a negative tolerance of a width of the groove of the concave roller, and corresponding copper bars and silver bars, and performing a surface treatment on the copper frame, the copper bars, and the silver bars; and then arranging different numbers of copper bars and silver bars at intervals as needed, and tightly placing into the copper frame to form a composite blank
Implementation Method 2
performing a diffusion annealing treatment on the alternating arrangement silver-copper lateral composite strip obtained in step S1 under a protective atmosphere, so that a bonding mode between interfaces of silver and copper is changed from the preliminary mechanical engagement to a combined action of the mechanical engagement and a metallurgical bonding
Data Source
AI summary
A method for preparing an alternating arrangement silver-copper lateral composite ingot, including: using a concave roller set; manufacturing a copper frame having a fixed width according to a negative tolerance of a width of the grooves of the concave roller, and corresponding copper bars and silver bars, and performing a surface treatment on the copper frame, the copper bars, and the silver bars; and then arranging different number of copper bars and silver bars at internals as needed and tightly placing into the copper frame to form a composite blank, i.e., a composite ingot. A method for preparing an alternating arrangement silver-copper lateral composite strip is further provided, and the silver-copper lateral composite ingot prepared by the method for preparing the alternating arrangement silver-copper lateral composite ingot is used to prepare the silver-copper lateral composite strip.