Silver Etching Composition for Display Device Manufacturing
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Solution Overview
Problem
The challenge in manufacturing display devices is the limited efficiency of etching processes for multilayer films containing silver, which often results in weak bonding with other layers and the generation of silver particles due to the use of phosphoric acid etchants, leading to defects and reduced manufacturing efficiency.
Innovation Solution
An etchant composition comprising sulfurized peroxide, nitric acid, organic acid, ferric nitrate, ionic sequestrant, and corrosion inhibitor is used to concurrently etch silver and conductive films without phosphoric acid, ensuring uniform etching and reducing silver particle formation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If phosphoric acid etchant is used to etch silver-containing multilayer films, then etching can be performed, but silver particles are generated and re-adsorbed causing defects
Solution Approach 1:
The patent changes the chemical composition parameters of the etchant by replacing phosphoric acid with a combination of sulfurized peroxide (1-15 wt%), nitric acid (5-10 wt%), and organic acid (20-40 wt%). This parameter change eliminates silver particle generation while maintaining etching capability, thus resolving the contradiction between productivity and reliability
Solution Approach 2:
The patent converts the harmful effect of silver particle generation into a benefit by using sulfurized peroxide which etches silver without causing particle precipitation. The etchant components work synergistically to dissolve silver ions into solution without reduction, turning a potentially harmful process into a beneficial one
2Reliability
If sequential etching is used to prevent silver particle formation, then defect reduction is achieved, but manufacturing efficiency deteriorates
Solution Approach 1:
The patent merges multiple etching functions into a single simultaneous etching process. The multi-component etchant formulation enables concurrent etching of silver and other conductive materials in one step, achieving both defect prevention and high manufacturing efficiency
Solution Approach 2:
The etchant composition is designed with universal etching capability for multiple materials. The combination of sulfurized peroxide, nitric acid, and organic acid provides multi-functionality to etch silver, copper, and other conductive materials simultaneously, eliminating the need for sequential processing
3Strength
If multilayer film structure is used to compensate weak bonding, then bonding strength is improved, but etching process complexity increases
Solution Approach 1:
The patent changes the etching parameters by using a multi-component chemical formulation that provides selective and controlled etching rates for different materials. This allows the complex multilayer structure to be etched in a single process step, maintaining bonding strength while simplifying the manufacturing process
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This etchant solution enables efficient and uniform etching of multilayer films, preventing silver particle re-adsorption and defects, thereby improving the manufacturing process and maintaining the desired characteristics of display device components.
Implementation Method 1
An etchant composition comprising sulfurized peroxide, nitric acid, organic acid, ferric nitrate, ionic sequestrant, and corrosion inhibitor is used to concurrently etch silver and conductive films
Implementation Method 2
sulfurized peroxide...about 1 wt % to about 15 wt % of sulfurized peroxide
Data Source
AI summary
An etchant includes: based on a total weight of the etchant, about 1 wt % to about 15 wt % of sulfurized peroxide, about 5 wt % to about 10 wt % of nitric acid, about 20 wt % to about 40 wt % of organic acid, about 0.05 wt % to about 5 wt % of ferric nitrate, about 0.1 wt % to about 5 wt % of ionic sequestrant, and 0.1 wt % to 5 wt % of corrosion inhibitor, wherein a remaining amount is deionized water.